SEMIKRON - IGBT, Diode, Thyristor, Power Semiconductor Modules, Chips, Assemblies


3	Hints for application
3.1	Dimensioning and selection of MOSFET, IGBT and SKiiPPACK modules	[ 133 ]
3.1.1	Forward blocking voltage	[ 133 ]
3.1.2	Forward current	[ 134 ]
3.1.3	Switching frequency	[ 135 ]
3.2	Thermal behaviour	[ 137 ]
3.2.1	Balance of power losses	[ 137 ]
3.2.1.1	Single and total power losses	[ 137 ]
3.2.1.2	Power losses of a step-down converter	[ 139 ]
3.2.1.3	Power losses in pulsed voltage source inverters/rectifiers with sinusoidal currents	[ 140 ]
3.2.2	Calculation of the junction temperature	[ 146 ]
3.2.2.1	General hints	[ 146 ]
3.2.2.2	Junction temperature during short-time operation	[ 148 ]
3.2.2.3	Junction temperature under pulse operation	[ 150 ]
3.2.2.4	Junction temperature at fundamental harmonics frequency	[ 152 ]
3.2.3	Evaluation of temperature characteristics with regards to module life	[ 154 ]
3.3	Cooling of power modules	[ 155 ]
3.3.1	Cooling devices, coolants and cooling methods	[ 155 ]
3.3.2	Thermal model of the cooling device	[ 156 ]
3.3.3	Natural air cooling (free convection)	[ 157 ]
3.3.4	Forced air cooling	[ 157 ]
3.3.5	Water cooling	[ 161 ]
3.3.6	Heatsink ratings for SKiiPPACKs on standard heatsinks	[ 162 ]
3.3.6.1	Forced air cooling	[ 162 ]
3.3.6.2	Liquid cooling	[ 164 ]
3.4	Power design	[ 165 ]
3.4.1	Parasitic inductances and capacitances	[ 165 ]
3.4.2	EMI/mains feedbacks	[ 168 ]
3.4.2.1	Processes in the converter	[ 168 ]
3.4.2.2	Causes of interference currents	[ 169 ]
3.4.2.3	Propagation paths	[ 170 ]
3.4.2.4	EMI suppression measures	[ 173 ]
3.4.3	Power units ready for installation	[ 174 ]
3.5	Driver	[ 178 ]
3.5.1	Gate voltage and gate current characteristics	[ 178 ]
3.5.2	Influence of driver parameters on switching features	[ 181 ]
3.5.3	Driver circuit structures and basic requirements on drivers	[ 184 ]
3.5.4	Integrated protection and monitoring functions of a driver	[ 187 ]
3.5.5	Time constants and interlock functions	[ 188 ]
3.5.6	Transmission of control signal and driving energy	[ 189 ]
3.5.6.1	Control data and feedback	[ 191 ]
3.5.6.2	Driving energy	[ 191 ]
3.5.7	Driver circuits for power MOSFETs and IGBTs	[ 192 ]
3.5.8	SEMIDRIVER	[ 192 ]
3.5.8.1	OEM-drivers [225], [264], [272]	[ 193 ]
3.5.8.2	SKiiPPACK-drivers [112], [264]	[ 195 ]
3.6	Fault behaviour and protection	[ 199 ]
3.6.1	Types of faults	[ 199 ]
3.6.2	Behaviour of IGBTs and MOSFETs during overload and short-circuit operation	[ 202 ]
3.6.3	Fault detection and protection	[ 208 ]
3.6.3.1	Detection and reduction of fault currents	[ 208 ]
3.6.3.2	Overvoltage limitation	[ 211 ]
3.6.3.3	Overtemperature detection	[ 217 ]
3.7	Parallel and series connection of MOSFET, IGBT and SKiiPPACK modules	[ 218 ]
3.7.1	Parallel connection	[ 218 ]
3.7.1	Parallel connection	[ 218 ]
3.7.1.1	Problems of current sharing	[ 218 ]
3.7.1.2	Module selection, driver circuit, layout	[ 221 ]
3.7.1.3	Parallel connection of SKiiPPACK modules	[ 223 ]
3.7.2	Series connection	[ 225 ]
3.7.2.1	Problems of voltage sharing	[ 225 ]
3.7.2.2	Module selection, driver circuit, snubber networks, layout	[ 226 ]
3.8	Soft switching in ZVS or ZCS-mode / switching loss reduction networks	[ 231 ]
3.8.1	Requirements and application fields	[ 231 ]
3.8.2	Switching loss reduction networks	[ 232 ]
3.8.3	Soft switching	[ 234 ]
3.8.3.1	Typical current and voltage characteristics / power semiconductor stress	[ 234 ]
3.8.3.2	Requirements on semiconductor switches and their drivers	[ 237 ]
3.8.3.3	Features of switches	[ 239 ]
3.8.3.4	Conclusions	[ 244 ]
3.9	Handling of MOSFET, IGBT, MiniSKiiP and SKiiPPACK modules	[ 245 ]
3.9.1	Sensitivity to ESD and measures for protection	[ 245 ]
3.9.2	Mounting instructions	[ 245 ]
3.9.3	SKiiPPACK: thermal testing ex works [ [265] ], [ [93] ], [ [233] ]	[ 246 ]
3.10	Dimensioning software	[ 246 ]
3.10.1	Model levels of mathematical circuit description	[ 246 ]
3.10.2	SEMIKRON software service	[ 250 ]

Application

Index