SKiN Technology

Spring technology

• Solder-free and cost-effi cient
• Fast & easy single-screw PCB to module connection
• Spring contacts facilitate PCB layout considerably
• Low level of wear

 

Wire bond-free

• Wire bonds replaced by a sintered SKiN fl ex layer
• Double-sided chip sintering for excellent thermal and electrical chip characteristics
• Continuous sinter layer on top of chips for 25% higher surge currents compared to wire bonds

 

Thermal paste-free

• 30% lower thermal resistance
• Increased thermal conductivity results in a better chip cooling and higher inverter current
• Thermal paste replaced by sinter layer between DBC and heat sink

Standard Technology		SKiN® Technology

SKiN technology is a fl exible foil used in place of wire bonds and, in combination with sinter technology, allows double inverter power density, leading to a 35% reduction in inverter volume. The driver interface uses springs contacting the surface of the fl exible foil.

 

• 10 x higher power cycling compared than standard modules
• Expected life time: 20 years
• Sinter technology enables high chip junction temperatures ≥ 200° C for SiC and GaN to be exploited