• Advanced level shifter technology
• Bootstrap power supply technology
• 3,3 / 5V CMOS, LSTTL compatible input interface
• Matched propagation delay for all channels
• Overcurrent shut-down via current sensing
• Interlock logic for shoot-through prevention
• Common shut-down input signal
• Undervoltage lockout for all channels with hysteresis band
• Trench-Field-Stop IGBTs
• CAL inverse diode (control axial lifetime)
• Integrated temperature sensor (NTC)
• RoHS compliant

HV driver IC in SOI technology:
The high voltage driver IC provides an advanced level shifter technology for 600V and 1200V applications. Thus there is no need of an opto-coupler. Because of a low quiescent current demand a bootstrap power supply technology is used. 

No latch-up:
The high voltage SOI technology ensures latch-up immunity since all switches are dielectrically insulated. A down-level shifter for each channel allows the presence of negative secondary offset voltages. The integrated gate driver operates at any offset voltage down to -50V, providing a flexible power system. 

Protection :
The gate driver features an overcurrent shutdown circuit protection by using an external shunt resistor in the ground plane to shut down the IPM in case of overcurrent, as well as an undervoltage lockout for all channels and fault signaling. A shut-down can be also forced by the system controller using the shut-down input. Cross conductions are prevented by the interlock logic.

Solder-free assembly:
Power, control and auxiliary contacts are connected directly to the printed circuit board with pressure contacts (springs) instead of solder joints. The all in one MiniSKiiP package reduces handling and parts count compared to discrete designs.

One step mounting:
The simple snap-on mounting with one standard screw allows for a cost-efficient assembly of semiconductor, printed circuit board and heat sink in one step. The elimination of solder connections (no cold solder joints, no bent terminals and no drill holes in printed circuit board) improves the quality of the assembly. In contradiction to a solder assembly, a defect printed circuit board can be easily removed from the MiniSKiiP IPM. 

Lowest thermal resistance:
With the combination of pressure contact technology, evenly distributed vertical pressure, spring contacts and the base plate free housing, MiniSKiiP IPM achieves the best thermal resistance in its class. Compared to existing IPM technologies MiniSKiiP IPM realizes an optimized current density, leading to high power cycling capability and a long lifetime.