Technology evolution



Technology evolution

     

    2011

    

    SKIN layer replaces wire bonds.

    Chip sintering on both sides.

    Sinter layer replaces thermal paste.

SKiN technology®


    2007

    

    The solder layer between Cooler and

    DBC as well as DCB and chip is

    replaced by cold-welded silver bonds,

    making the module 100% solder free.

    SKiiP®4 MiniSKiiP IPM SKiM®


    1996

    

    Spring contacts replace solder pins and

    provide electrical connection to the

    controller.

    SKiM®


    1992

    

    The pressure contact technology

    reduces the number of solder layers.

    No copper base plate is needed.

    SKiiP®4 MiniSKiiP IPM SKiM®


    1974

    

    Standard Technology with solder pins

    and screw terminals. 

 


 

Technology evolution

SEMISEL Thermischer Calculator & Simulator
SEMISEL