Technology evolution

    2011

    SKIN layer replaces wire bonds.

    Chip sintering on both sides.

    Sinter layer replaces thermal paste.

SKiN technology®

    2007

    The solder layer between Cooler and

    DBC as well as DCB and chip is

    replaced by cold-welded silver bonds,

    making the module 100% solder free.

    SKiiP®4 MiniSKiiP IPM SKiM®

    1996

    Spring contacts replace solder pins and

    provide electrical connection to the

    controller.

    SKiM®

    1992

    The pressure contact technology

    reduces the number of solder layers.

    No cooper base plate is needed.

    SKiiP®4 MiniSKiiP IPM SKiM®

    1947

    Standard Technology with solder pins

    and screw terminals