-
- IGBT Modules
- SEMITRANS
- SEMITRANS - Low-inductive design with 15 nH
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMiX
- SEMiX - now with new IGBT4 chips
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SKiM 63/93
- SKiM 63/93 - 100% solder-free ensures durability
- SKiM 63/93 Datasheets
- SKiM 63/93 Technical Explanations
- SKiM 63/93 Technical Articles
- SKiM 63/93 Press Releases
- SKiM 4/5
- SKiM 4/5 - For 3-level UPS inverter
- SKiM 4/5 Datasheets
- SKiM 4/5 Technical Explanations
- SKiM 4/5 Technical Articles
- SKiM 4/5 Press Releases
- SKiiP IPM
- SKiiP IPM - for high operation temperatures
- SKiiP IPM Datasheets
- SKiiP IPM Technical Explanations
- SKiiP IPM Technical Articles
- SKiiP IPM Press Releases
- MiniSKiiP
- MiniSKiiP - Fast one-screw mounting
- MiniSKiiP Datasheets
- MiniSKiiP Technical Explanations
- MiniSKiiP Technical Articles
- MiniSKiiP Press Releases
- MiniSKiiP IPM
- MiniSKiiP IPM - 50 % higher current density
- MiniSKiiP IPM Datasheets
- MiniSKiiP IPM Technical Explanations
- MiniSKiiP IPM Technical Articles
- MiniSKiiP IPM Press Releases
- MiniSKiiP CIB
- MiniSKiiP CIB - Converter Inverter Brake
- MiniSKiiP CIB Datasheets
- MiniSKiiP CIB Technical Explanations
- MiniSKiiP CIB Technical Articles
- MiniSKiiP CIB Press Releases
- SEMITOP
- SEMITOP - For 3-level UPS inverter
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITOP CIB
- SEMITOP CIB - High reliability
- SEMITOP CIB Datasheets
- SEMITOP CIB Technical Explanations
- SEMITOP CIB Technical Articles
- SEMITOP CIB Press Releases
- SEMITRANS
- MOSFET Modules
- SEMITRANS
- SEMITRANS - N Channel, enhancement mode
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMITOP
- SEMITOP - Trench-gate technology
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITRANS
- Thyristor / Diode Modules
- SEMIPACK
- SEMIPACK - 35 years expertise
- SEMIPACK Datasheets
- SEMIPACK Technical Explanations
- SEMIPACK Technical Articles
- SEMIPACK Press Releases
- SEMIPACK Fast
- SEMIPACK Fast - Soft recovery
- SEMIPACK Fast Datasheets
- SEMIPACK Fast Technical Explanations
- SEMIPACK Fast Technical Articles
- SEMIPACK Fast Press Releases
- SEMITOP
- SEMITOP - Glass passivated thyristor chips
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMiSTART
- SEMiSTART - Thyristor with amplifying gate
- SEMiSTART Datasheets
- SEMiSTART Technical Explanations
- SEMiSTART Technical Articles
- SEMiX
- SEMiX - Chips soldered directly to isolated substrate
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMIPONT
- SEMIPONT - Integrated temperature sensor
- SEMIPONT Datasheets
- SEMIPACK
- Bridge Rectifiers
- SEMiX
- SEMiX - Terminal height 17 mm
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMITOP
- SEMITOP - One screw mounting
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMIPONT
- SEMIPONT - 1600V reverse voltage
- SEMIPONT Datasheets
- Power Bridge
- Power Bridge - High blocking voltage
- Power Bridge Datasheets
- Power Bridge Technical Explanations
- Miniature Leaded
- Miniature Leaded - High surge current
- Miniature Leaded Datasheets
- Miniature Leaded Technical Explanations
- Miniature Fast On
- Miniature Fast On - Easy chassis mounting
- Miniature Fast On Datasheets
- Miniature Fast On Technical Explanations
- MiniSKiiP
- MiniSKiiP - Bridge
- MiniSKiiP Datasheets
- SEMiX
- Discretes
- Capsule Diode
- Capsule Diode - Low power dissipation
- Capsule Diode Datasheets
- Capsule Diode Technical Explanation
- Surface Mount Diode
- Surface Mount Diode - Surface Mount Diode
- Standard recovery datasheets
- Fast and ultrafast recovery datasheets
- Zener datasheets
- Schottky datasheets
- Transient voltage surpressor datasheets
- Avalanche datasheets
- Stud Diode
- Stud Diode - Stud Diode
- Standard recovery datasheets
- Fast recovery datasheets
- Avalanche datasheets
- Stud Diode Technical Explanation
- Leaded Diode
- Stud Thyristor
- Stud Thyristor - Stud Thyristor
- Stud Thyristor Datasheets
- Stud Thyristor Technical Explanation
- Capsule Thyristor
- Capsule Thyristor - Hermetic metal case with glass insulator
- Capsule Thyristor Datasheets
- Capsule Thyristor Technical Explanation
- Freewheeling Diode Chips
- Freewheeling Diode Chips - freewheeling diode for IGBT
- Freewheeling Diode - CAL / CAL I3 Fast
- Freewheeling Diode - CAL I4 Fast
- Freewheeling Diode - CAL High Density
- Freewheeling Diode Chips Technical Explanations
- Rectifier Chips
- Rectifier Chips - uncontrolled rectifier bridges
- Rectifier Chips Datasheets
- Rectifier Chips Technical Explanations
- Thyristor Chips
- Thyristor Chips - controlled rectifier circuits
- Thyristor Chips Datasheets
- Thyristor Chips Technical Explanations
- Capsule Diode
- Drivers
- Accessories
- Heat Sink
- Heat Sink - Designed for natural or forced air cooling
- Heat Sink Datasheets
- Fans
- Fans - Low noise level
- Fans Datasheets
- Fuses
- Fuses - total height H = 38 ,5 mm
- Fuses Datasheets
- Heat Sink
- IGBT Modules
SKiiP 4 IPM
- Sintered chips - for high operation temperatures
Mechanically compatible to SKiiP®3
33% more power, same volume
Reliability
5 x higher temperature cycling
Benefits of SKiiP®4 driver
- Digital signal transmission for high signal integrity and noise immunity
- All switching and sensor signals are galvanically insulated
- Diagnose channel (CAN open protocol)
- Multi-output stage for soft switching behaviour and low over-voltage
SKiiP
4th generation
Intelligent Power Module: IPM
Melting temp. is 6 x higher than operating temperatures
- 3 in 1: Driver, semiconductor, cooling
- 400 kW - 1,8 MW
- 33% more power, same volume
- 5 x higher thermal cycling capability
- Sintered chips - for high operation temperatures
- 3 in 1: Driver, semiconductor, cooling
- 400 kW - 1,8 MW
- 33% more power, same volume
- 5 x higher thermal cycling capability
- Sintered chips - for high operation temperatures
Melting temp. is 6 x higher than operating temperatures
Datasheets
If you still see this text after 10 to 15 seconds JavaScript is disabled in your Browser. To view this page correctly, you need to enable JavaScript.
Product Search
Product Search
SEMISEL Simulation
SEMISEL Simulation
SEMISEL Thermal calculator & simulator
