Sinter Technology

• 5 % improvement in total thermal resistance thanks to silver layer
• Unbreakable joint between die and DCB
• High melting point at > 900° C (4 x higher than standard solder) - no solder fatigue

IGBT 4 and CAL4F Technology

• Tj, max = 175° C, the key to higher current capability

New pressure contact design

• Low-inductive design
• Improved homogenous current distribution

Robust mechanical design

• High resistance to mechanical shocks and vibrations

• Digital signal transmission for high signal integrity and noise immunity
• All switching and sensor signals are safety isolated
• Multi-output stage for soft switching behaviour and low over-voltage
• HALT interface for fast error reaction between SKiiPs
• CANopen based diagnosis channel with error recorder