New SEMIKRON modules in every power class
for 3-level solar and UPS applications
3-level technology will now be available for IGBT modules, MiniSKiiP, SEMITOP and SKiM 4 modules across a wide range of power classes / Two 3-level topologies / TNPC for SKiM 4 up to 900VDC and 480VAC / NPC for MiniSKiiP and SEMITOP for up to 1500 VDC and 1000 VAC
Nuremberg, April 12, 2012 – SEMIKRON, a global leader in the field of power electronics, will be adding 3-level topologies to its product range. 3-level technology boasts a lower distortion factor and consequently reduced filtering requirements. This is a very important feature, especially in applications where a very clear output voltage and output current waveform is needed, e.g. uninterrupted power supply systems (UPS) and solar inverters. The product range will now include MiniSKiiP, SEMITOP and SKiM 4 IGBT modules.
The baseplate-free SKiM4 module is the most powerful IGBT module in the range, with rated currents of between 200A and 600A. As much as 250kVA can be achieved without several modules having to be connected in parallel. SKiM4 modules come in TNPC technology for 650V and 1200V, and 1200V in NPC topology. The modules in TNPC topology can deliver up to 900VDC and 480VAC, while those in NPC topology can push the EU low voltage directive to its limits of 1500 VDC and 1000 VAC.
For smaller currents, baseplate-free, spring-contact IGBT MiniSKiiP modules are available. These modules feature solder-free mounting and are intended for rated currents of between 75A and 200A and reverse voltages of 650V, enabling powers of up to 85kVA. At 4.9A/cm², the power density is very high compared with competitor products, making this module ideal for use in compact systems. A further merit of these modules is the easy single-screw connection between module and heat sink and controller board.
The counterpart to solder-free MiniSKiiP modules is the SEMITOP, an IGBT module which is 12mm in height and soldered on to the Power Circuit Boards and used in applications with current ratings of 20A -150A. These baseplate-free solder-connection modules come in NPC topology and can deliver up to 65kVA. The voltage rating is 600V.
The fact that no solid busbars are needed in SEMITOP and MiniSKiiP modules is the reason for their compact design.
About 3-level technology
3-level technology was originally intended to be used to control voltages that were greater than the reverse voltage of the semiconductor device. Now the main purpose of this technology can be found in the output voltage waveform: instead of the full positive or negative DC link voltage, now half the DC link voltage is available for each side.
In 3-level technology the multi-stage waveform is closer to an ideal sine wave than is the case for conventional 2-level topologies. The biggest advantage of 3-level technology is the lower distortion factor and consequently reduced filtering requirements. This is particularly important in applications where very clear output voltage and output current waveforms are needed, e.g. uninterruptible power supply systems or solar inverter applications.
About NPC and T-NPC topologies
SEMIKRON manufactures power modules in two different 3-level topologies: NPC (Neutral Point Clamped) and TNPC (T-Type Neutral Point Clamped), both of which have their advantages.
The advantage of NPC technology lies in the fact that it allows for a higher overall DC link voltage than each individual semiconductor die would be able to block. This enables manufacturers of solar inverters to apply a DC link voltage of up to 1500VDC to the power modules as opposed to the maximum DC link of around 1100VDC in 2-level modules.
In terms of error management, NPC topology is less complex than TNPC, although the same high-quality output voltage waveform is achievable with both topologies. On the other hand, TNPC modules are slightly more powerful than NPC modules, since they require 8 rather than 10 different semiconductor dice.
Figure: 3-level NPC and 3-level TNPC topologies, both available in SEMIKRON phase modules.
SEMIKRON is a leading global power semiconductor manufacturer. The German-based family enterprise employs 3900 people worldwide. A global network of 36 companies with production plants in Brazil, China, France, Germany, India, Italy, Korea, Slovakia, South Africa and USA guarantees fast and competent on-site customer care. SEMIKRON is a one-stop provider of chips, discrete semiconductors, transistor, diode and thyristor power modules, power assemblies and systems for markets such as industrial drives, wind and solar, hybrid and electric vehicles, the rail industry and power supply systems. SEMIKRON is the market leader in the field of diode/thyristor semiconductor modules, enjoying a 30% share of the worldwide market. (Source: IMS Research, The World Market for Power Semiconductor Discretes & Modules – 2011 Edition).
Our dedication to the hybrid and electric vehicle market is evident in the development and production of power semiconductors for this market, as well as in the majority take-over of Compact Dynamics GmbH, a development specialist for innovative control systems, the joint venture with drivetek, a provider for application-specific control technology, and the take-over of VePOINT, developing and producing inverters, DC/DC converters and chargers. Recently, SEMIKRON introduced a revolutionary packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN Technology is based on the use of a flexible foil and sintered connections rather than bond wires, solders and thermal paste. This results in a higher current carrying capacity and 10 times the load cycle capability – unthinkable with the restrictive wire bonding used in power electronics in the past. This enables a reduction in converter volume by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.
SEMIKRON INTERNATIONAL GmbH
Tel: +49-(0) 911-6559-829