Intelligent Power Module moves 31 of 72,6 Gigawatt wind power capacity
Five times higher thermal cycling capability
Nuremberg, 27th November 2007- For the dynamically growing wind power market SEMIKRON offers the ready for use SKiiP, an intelligent power module (IPM) with perfectly matched cooling, gate driver, current sensors and protective functions already integrated. High load and temperature cycling capability is ensured with the patented SKiiP pressure contact technology. With a power range into the MW range, this IGBT subsystem is the most powerful IPM available in the market. The total wind power capacity installed since 1993 worldwide is 72,6 Gigawatt. (Source: EurObserver, Systems Solaires No177, Wind Energy Barometer, 02/2007)
More than 15 years of experience in pressure contact technology is integrated into the SKiiP® power subsystem. The principle of the technology used for the halfbridges is to use mechanical pressure via the pressure plate and the bridge element, pressing the DBC to the heat sink without soldering – a thermal paste of merely 10-20µm is needed. This results in a homogenous pressure distribution. Consequently a thermal connection between the ceramic substrates carrying the semiconductor chips and the heat sink is produced. This leads to an improved thermal resistance (Rth(j-s)) of 40% compared to standard solutions. SKiiP® has no base plate and less solder layers with the result that there is lower thermal-mechanical stress inside the module. The thermal cycling capability is five times higher than standard solutions with base plate and is reached even under the harsh climatic conditions renowned in the wind energy industry. “The SKiiPâ subsystem meets the stringent demands of the wind energy industry due to its high operational reliability, long service life expectancy, efficiency and scalable designs”, said Ralf Herrmann, Product Manager at SEMIKRON. SKiiP® which was expressly developed for wind applications, showed a growth rate of 85% in 2006.
Today, as much as 43% of all wind generators feature SEMIKRON technology. The total wind power capacity installed since 1993 worldwide is 72,6 Gigawatt. (Source: EurObserver, Systems Solaires No177, Wind Energy Barometer, 02/2007) According to the European Renewable Energy Council, renewable energies will cover more than 35% of energy needs worldwide by the year 2030. Against the backdrop of a dynamically growing market, these intelligent integrated subsystems are ideal for use in wind generators and reduce production times and, consequently, the time to market.
Figure 1. SKiiP® intelligent power module, with perfectly matched cooling, gate driver, current sensors and protective functions already integrated. optimised for wind applications
About SEMIKRON: Founded in 1951, German-based SEMIKRON is a family enterprise that employs 2,700 people worldwide. SEMIKRON comprises of a global network of 35 companies that guarantees a fast and competent on-site customer care. According to a study carried out by IMS, a leading Market Research Institute, SEMIKRON is the market leader in the field of Diode/Thyristor modules, enjoying a 34% share of the worldwide market.
SEMIKRON’s product range consists of 21000 different power semiconductors including chips, discrete diodes/thyristors, power modules (IGBT / MOSFET / diode / thyristor), driver and protection components and integrated subsystems. “SEMIKRON inside“ has become a trade mark for industrial applications such as electric drives, wind power generators, solar, electric vehicles, welding machines, lifts, power supplies, conveyor belts and trams. As a significant innovator in the power electronics sector, many of SEMIKRON’s progressive developments have been accepted as industrial standards. The expertise of the Solution Centres from each continent is combined into a unique network, to develop and manufacture subsystems designed for specific applications and requirements.
For more information, visit www.SEMIKRON.com.