Press Release

2007-07-17

The first 100% solder-free IGBT module

Five times higher temperature cycling capability for automotive industry

 

SEMIKRON introduces a 100% solder-free IGBT module for 22 kW – 150kW train drive converters in electric and hybrid vehicles. SKiM® has a five times higher temperature cycling capability compared to modules with base plate and soldered terminals.

 

While some power semiconductor manufacturers are still improving soldered contacts to meet the high temperature requirements of the automotive industry, solder-free pressure contact technology and sintered chips is the optimal solution to increase the temperature cycling capability to 10.000 cycles at Δ100K. Due to the high temperature capabilities of Tjunction = 175 °C and Tambient = 135 °C, one separate coolant loop can be omitted.

 

The solder-free pressure system and an internal laminated bus bar cause a homogeneous current distribution. Every IGBT and diode chip has its own connection to the main terminal. The result is a low module resistance of RCC’+EE’ ≤ 0,3 mΩ compared to soldered modules with approximately 1,1 mΩ.

 

The connection to the driver board is also solder-free with springs for high temperature cycling and fast solder-free mounting.

 

The chips are not soldered but sintered to achieve the high power cycling capability.  The sinter joint is a thin silver layer that has a superior thermal resistance than a soldered joint and due to the high melting point of silver no joining fatigue leading to an increased service life.

 

Since there is no base plate, the connection of the DCB to the heat sink has the ability to “move” with no limitation of temperature cycling reliability. SKiM® withstands the stringent automotive standards being highly resistant against shock and vibration stress.

 

The packaging and connection technology of the SKiM® module fully exploits the silicon capabilities resulting in a cost-efficient solution. More than 15 years of experience in pressure contact technology is integrated into the SKiM® IGBT module. 1000 hybrid busses and 400.000 electric forklifts are already driven by pressure contact.

 

The fast design-in is guaranteed by the standard terminal height of 17 mm and a configuration similar to other six pack modules. Two case sizes are available: SKiM® 63 (120 x 160 mm²) SKiM® 93 (150 x 160 mm²)

 

Photo: SKiM® 63

 

About SEMIKRON: Founded in 1951, German-based SEMIKRON is a family enterprise that employs 2,700 people worldwide. SEMIKRON comprises of a global network of 35 companies that guarantees a fast and competent on-site customer care.  According to a study carried out by IMS, a leading Market Research Institute, SEMIKRON is the market leader in the field of Diode/Thyristor modules, enjoying a 30% share of the worldwide market.

 

SEMIKRON’s product range consists of 21000 different power semiconductors including chips, discrete diodes/thyristors, power modules (IGBT / MOSFET / diode / thyristor), driver and protection components and integrated subsystems. “SEMIKRON inside“ has become a trade mark for industrial applications such as electric drives, wind power generators, solar, electric vehicles, welding machines, lifts, power supplies, conveyor belts and trams.  As a significant innovator in the power electronics sector, many of SEMIKRON’s progressive developments have been accepted as industrial standards. The expertise of the Solution Centres from each continent is combined into a unique network, to develop and manufacture subsystems designed for specific applications and requirements.

 

For more information, visit www.SEMIKRON.com.

 

 

The first 100% solder-free IGBT module

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