Technology



SiNTER Technology

SiNTER Technology in combination with SKiiP Technology® results in an increased service life time of a module because critical solder is omitted. The chips are not leaded but sintered by a cold weld to the ceramic. The operating chip temperature of 175ºC is only 18% of the melting temperature of the sinter layer (solder: 60%). This shows that compared to the solder layer, the sinter layer will not fatigue over time in the application.

 

SiNTER Technology

SEMISEL Thermal calculator & simulator
SEMISEL
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