SKiN Technology



Spring integration

Spring technology

  • Solder-free and cost-effi cient
  • Fast & easy single-screw PCB to module connection
  • Spring contacts facilitate PCB layout considerably
  • Low level of wear

 

Wire bond-free

  • Wire bonds replaced by a sintered SKiN fl ex layer
  • Double-sided chip sintering for excellent thermal and electrical chip characteristics
  • Continuous sinter layer on top of chips for 25% higher surge currents compared to wire bonds

 

Thermal paste-free

  • 30% lower thermal resistance
  • Increased thermal conductivity results in a better chip cooling and higher inverter current
  • Thermal paste replaced by sinter layer between DBC and heat sink

Standard

Technology

 

SKiN®

Technology

     
 

SKiN technology is a fl exible foil used in place of wire bonds and, in combination with sinter technology, allows double inverter power density, leading to a 35% reduction in inverter volume. The driver interface uses springs contacting the surface of the fl exible foil.

 

 

10 x higher power cycling

  • 10 x higher power cycling compared than standard modules
  • Expected life time: 20 years
  • Sinter technology enables high chip junction temperatures ≥ 200° C for SiC and GaN to be exploited

 

 

 

SKiN Technology

Wire bond-free

SKiN Technology

Spring integration


 

Technical Article:

Semikron Evolution SKiN


Press release:

Goodbye to Bond Wires



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