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- IGBT Modules
- SEMITRANS
- SEMITRANS - Low-inductive design with 15 nH
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMITRANS MCDS
- SEMiX
- SEMiX - now with new IGBT4 chips
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMiX MCDS
- SKiM 63/93
- SKiM 63/93 - 100% solder-free ensures durability
- SKiM 63/93 Datasheets
- SKiM 63/93 Technical Explanations
- SKiM 63/93 Technical Articles
- SKiM 63/93 Press Releases
- SKiM 4/5
- SKiM 4/5 - For 3-level UPS inverter
- SKiM 4/5 Datasheets
- SKiM 4/5 Technical Explanations
- SKiM 4/5 Technical Articles
- SKiM 4/5 Press Releases
- SKiiP IPM
- SKiiP IPM - for high operation temperatures
- SKiiP IPM Datasheets
- SKiiP IPM Technical Explanations
- SKiiP IPM Technical Articles
- SKiiP IPM Press Releases
- SKiiP Accessories
- MiniSKiiP
- MiniSKiiP - Fast one-screw mounting
- MiniSKiiP Datasheets
- MiniSKiiP Technical Explanations
- MiniSKiiP Technical Articles
- MiniSKiiP Press Releases
- MiniSKiiP MCDS
- MiniSKiiP IPM
- MiniSKiiP IPM - 50 % higher current density
- MiniSKiiP IPM Datasheets
- MiniSKiiP IPM Technical Explanations
- MiniSKiiP IPM Technical Articles
- MiniSKiiP IPM Press Releases
- SEMITOP
- SEMITOP - For 3-level UPS inverter
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITOP MCDS
- SEMITOP CIB
- SEMITRANS
- MOSFET Modules
- SEMITRANS
- SEMITRANS - N Channel, enhancement mode
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMITOP
- SEMITOP - Trench-gate technology
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITRANS
- Thyristor / Diode Modules
- SEMIPACK
- SEMIPACK - 35 years expertise
- SEMIPACK Datasheets
- SEMIPACK Technical Explanations
- SEMIPACK Technical Articles
- SEMIPACK Press Releases
- SEMIPACK MCDS
- SEMIPACK Fast
- SEMIPACK Fast - Soft recovery
- SEMIPACK Fast Datasheets
- SEMIPACK Fast Technical Explanations
- SEMIPACK Fast Technical Articles
- SEMIPACK Fast Press Releases
- SEMITOP
- SEMITOP - Glass passivated thyristor chips
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMiSTART
- SEMiSTART - Thyristor with amplifying gate
- SEMiSTART Datasheets
- SEMiSTART Technical Explanations
- SEMiSTART Technical Articles
- SEMiX
- SEMiX - Chips soldered directly to isolated substrate
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMIPONT
- SEMIPONT - Integrated temperature sensor
- SEMIPONT Datasheets
- SEMIPACK
- Bridge Rectifiers
- SEMiX
- SEMiX - Terminal height 17 mm
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMITOP
- SEMITOP - One screw mounting
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMIPONT
- SEMIPONT - 1600V reverse voltage
- SEMIPONT Datasheets
- Power Bridge
- Power Bridge - High blocking voltage
- Power Bridge Datasheets
- Power Bridge Technical Explanations
- Miniature Leaded
- Miniature Leaded - High surge current
- Miniature Leaded Datasheets
- Miniature Leaded Technical Explanations
- Miniature Fast On
- Miniature Fast On - Easy chassis mounting
- Miniature Fast On Datasheets
- Miniature Fast On Technical Explanations
- MiniSKiiP
- MiniSKiiP - Bridge
- MiniSKiiP Datasheets
- SEMiX
- Discretes
- Leaded Diode
- Leaded Diode - Leaded Diode
- Standard recovery datasheets
- Avalanche datasheets
- Capsule Diode
- Capsule Diode - Low power dissipation
- Capsule Diode Datasheets
- Capsule Diode Technical Explanation
- Capsule Thyristor
- Capsule Thyristor - Hermetic metal case with glass insulator
- Capsule Thyristor Datasheets
- Capsule Thyristor Technical Explanation
- Freewheeling Diode Chips
- Freewheeling Diode Chips - freewheeling diode for IGBT
- Freewheeling Diode - CAL / CAL I3 Fast
- Freewheeling Diode - CAL I4 Fast
- Freewheeling Diode - CAL High Density
- Freewheeling Diode - CAL I4 High Density
- Freewheeling Diode Chips Technical Explanations
- Rectifier Chips
- Rectifier Chips - uncontrolled rectifier bridges
- Rectifier Chips Datasheets
- Rectifier Chips Technical Explanations
- Thyristor Chips
- Thyristor Chips - controlled rectifier circuits
- Thyristor Chips Datasheets
- Thyristor Chips Technical Explanations
- Leaded Diode
- Drivers
- Accessories
- Heat Sink
- Heat Sink - Designed for natural or forced air cooling
- Heat Sink Datasheets
- Fans
- Fans - Low noise level
- Fans Datasheets
- Fuses
- Fuses - total height H = 38 ,5 mm
- Fuses Datasheets
- Heat Sink
- Silicon Carbide Components
- IGBT Modules
Technology
- SPRING, SKiiP and SiNTER
SEMIKRON sets standards
Our SPRiNG, SKiiP and SiNTER technologies have made us one of today’s global leaders in technology.
- SPRiNG Technology: complex solder bonds are cut down on. Spring contacts provide electrical connection to the controller.
- SKiiP Technology: reduces the number of solder layers, and no copper base plate is needed. The modules have 25% lower thermal resistance than soldered modules.
- SiNTER Technology: the solder layer between DBC and chip is replaced by cold-welded silver bonds, making the module 100% solder-free.
- SKiN Technology: Wire bond-free,Reliable and space-saving packaging technology for power semiconductors, Free from thermal paste and solder,10 x higher power cycling, Current density of power unit doubled: 3 A/cm2, For 35% smaller inverters
Innovations at a glance
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SEMISEL Simulation
SEMISEL Simulation
SEMISEL Thermal calculator & simulator
