- SPRING, SKiiP and SiNTER
SEMIKRON sets standards
- SPRiNG Technology: complex solder bonds are cut down on. Spring contacts provide electrical connection to the controller.
- SKiiP Technology: reduces the number of solder layers, and no copper base plate is needed. The modules have 25% lower thermal resistance than soldered modules.
- SiNTER Technology: the solder layer between DBC and chip is replaced by cold-welded silver bonds, making the module 100% solder-free.
- SKiN Technology: Wire bond-free,Reliable and space-saving packaging technology for power semiconductors, Free from thermal paste and solder,10 x higher power cycling, Current density of power unit doubled: 3 A/cm2, For 35% smaller inverters