Technology evolution

Technology evolution




    SKIN layer replaces wire bonds.

    Chip sintering on both sides.

    Sinter layer replaces thermal paste.

SKiN technology®



    The solder layer between Cooler and

    DBC as well as DCB and chip is

    replaced by cold-welded silver bonds,

    making the module 100% solder free.

    SKiiP®4 MiniSKiiP IPM SKiM®



    Spring contacts replace solder pins and

    provide electrical connection to the





    The pressure contact technology

    reduces the number of solder layers.

    No copper base plate is needed.

    SKiiP®4 MiniSKiiP IPM SKiM®



    Standard Technology with solder pins

    and screw terminals. 



Technology evolution

SEMISEL Thermal calculator & simulator
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