SKiiP IPM
- Most powerful IPM on the market
SKiiP®4 product range
2 - 3 times higher power cycling capability
Sinter Technology
- 5 % improvement in total thermal resistance thanks to silver layer
- Unbreakable joint between die and DCB
- High melting point at > 900° C (4 x higher than standard solder) - no solder fatigue
IGBT 4 and CAL4F Technology
- Tj, max = 175° C, the key to higher current capability
5 x higher temperature cycling
New pressure contact design
- Low-inductive design
- Improved homogenous current distribution
Robust mechanical design
- High resistance to mechanical shocks and vibrations
Benefits of SKiiP®4 driver
Function and self-protection
- Digital signal transmission for high signal integrity and noise immunity
- All switching and sensor signals are safety isolated
- Multi-output stage for soft switching behaviour and low over-voltage
- HALT interface for fast error reaction between SKiiPs
- CANopen based diagnosis channel with error recorder
SKiiP®4
Most powerful IPM on the market
- 3 in 1: driver, semiconductor & cooling
- Integrated current, voltage and temperature sensor
- Sintered chips, no solder fatigue
- 2 – 3 times higher power cycling capability
- 3 in 1: driver, semiconductor & cooling
- Integrated current, voltage and temperature sensor
- Sintered chips, no solder fatigue
- 2 – 3 times higher power cycling capability


















