技术文章

• IGBTs in Reverse Gear   

Stefan Schuler, André Müller
Bodo´s Power Systems, January 2012
2012-01 (0,67MB)

• A Look into the Future: Savings Potential in Inverter Design   

Andreas Gießmann, Alexander Langenbucher
Bodo's Power Systems, December 2011
2011-12 (0,23MB)

• MiniSKiiP: Taking Power Density to a new Level   

Alexander Langenbucher
Bodo's Power Systems September 2011
2011-09 (0,18MB)

• Semikron Evolution SKiN   

Peter Beckedahl
Power Electronics Europe July/August 2011
2011-09 (0,82MB)

• Enhanced 4th generation CAL diode for highly efficient applications   

Dr. Fryderyk Kozlowski, Dr. Bernhard Koenig, Dr. Martin Hansmann, Dr. Wolfgang Nichtl-Pecher
PCIM Asia 2011
2011-08 (0,19MB)

• Compact inverters for electrical powertrains: SKAI2   

Roland Mühlemann
Electric & Hybrid Vehicle Technology International July 2011
2011-07 (0,16MB)

• Of mills and modules   

Ina Röpcke, Journalist
Sun & Wind Energy July 2011
2011-07 (3,43MB)

• 用于可再生能源的SEMISTACK   

Alan Tims
2011-05 (1,81MB)

• Of Mills and Modules   

Ina Röpcke, Redakteurin
Sonne Wind & Wärme 5/2011
2011-04 (0,24MB)

• 无可比拟的比较   

Dr. Arendt Wintrich
2011-03 (0,47MB)

• Winds of Change for Brazil   

Michael Brunn, Editor in Chief, E&E
E&E March 2011
2011-03 (0,14MB)

• Fast Switching IGBTs Create New Challenges   

Stefan Schuler
Power Electronics Europe, Issue 1 2011
2011-02 (0,44MB)

• 三电平逆变器 – 便利的在线尺寸计算 (SemiSel)   

Alexander Langenbucher, Ingo Staudt
2011-01 (1,82MB)

• Challenges for Renewable Energy   

Thomas Grasshoff
Power Systems Design Europe 12/2010
2011-01 (0,46MB)

• Networking - the Recipe for Success in Power Electronics   

Dr. Thomas Stockmeier
Bodo's Power Systems 01/2011
2011-01 (0,04MB)

• Always one step ahead   

Michael Brunn, Editor-in-Chief E&E
E&E 08.2010
2010-12 (0,21MB)

• 用于混合动力和电动汽车的免焊接的功率模块   

Dr. Volker Demuth
2010-12 (1,13MB)

• Is there anything more fascinating than Power Electronics?   

Dr. Thomas Stockmeier
ELEKTRONIKPRAXIS electronica Magazine 2010
2010-11 (0,23MB)

• 风力发电   

Rainer Weiss, Ralf Herrmann
2010-11 (0,39MB)

• MiniSKiiP® IPM的尺寸仅为标准1200 V IPM的一半   

Musametin Zurnaci
2010-11 (0,16MB)

• IGBT Gate Driver Solutions for Low and Medium Power Applications   

R. Herzer, J. Lehmann, M. Rossberg, B. Vogler
Power Electronics Europe, Issue 6 2010
2010-10 (1,15MB)

• 无需额外传感器的芯片温度测量   

Dr. Uwe Scheuermann
2010-10 (0,49MB)

• 驱动器保护作用: IGBT 驱动器提供可靠保护   

Johannes Krapp
2010-10 (1,02MB)

• Integrated Gate Driver Circuit Solutions   

R. Herzer, J. Lehmann, M. Rossberg, B. Vogler
Issue 5 2010 Power Electronics Europe
2010-09 (1,06MB)

• 受控的大电流, 紧凑型汽车动力系统   

Paul Newman
2010-09 (0,79MB)

• Versatile Inverter Platform from 150 kVA to 3 MVA   

Alan Tims
Bodos Power Systems, August 2010
2010-08 (0,07MB)

• 为了不同的心愿 - 得益于在可扩展电力电子器件在电驱动系统上的应用，降低了成本且减少了空间   

Thomas Grasshoff
2010-08 (0,50MB)

• Integration of 1200V SOI gate driver ICs into a medium power IGBT module package   

Bastian Vogler, Matthias Rossberg, Reinhard Herzer, Lars Reusser (SEMIKRON)
Article published at ISPSD in Hiroshima, June 2010
2010-07 (2,15MB)

• Rapid Response Service on B2B eCommerce Portal.   

Dr. Walter Demmelhuber
Bodo's Power Systems, May 2010
2010-05 (0,00MB)

• 处理导热涂层时如何避免错误   

Dieter Esau, Dr. Michaela Strube
2010-05 (0,64MB)

• 更高效的三电平逆变器   

Norbert Pluschke, Thomas Grasshoff
2010-05 (0,00MB)

• At Semikron, personal responsibility and trust are the values that matter   

Michael Brunn E&E
E&E 03.2010 S. 28-31
2010-04 (0,00MB)

• 无需额外传感器的芯片温度测量   

Dr. U. Scheuermann
2009-11 (0,49MB)

• Intelligent Power Modules Drive Public Transport   

L. Sobotka, R. Herrmann
Power Electronics Europe October 2009
2009-11 (0,00MB)

• Shunt Current Measuring up to 800A in the Inverter   

R. Stark, K. Göpfrich, U. Hetzler
Power Electronics Europe October 2009
2009-11 (0,00MB)

• The Challenges and Opportunities for Power   

T. Grasshoff
Power Systems Design Europe October 2009
2009-11 (0,00MB)

• Demands for Renewable Energy and Electric Vehicles   

Dr. Thomas Stockmeier
ElektronikPraxis, electronica Magazin, November 2008, p.p. 82-85
2009-11 (0,00MB)

• 芯片的并联 - 从经典的最坏情况到统计方法   

Dr. U. Scheuermann
2009-09 (0,39MB)

• 能量转换, 功率半导体产业的需求挑战   

Aseem Wahi
2009-09 (0,74MB)

• Sintered modules boast higher operating temperature capability and extended service life   

Engelbert Hopf
Markt & Technik, Sonderheft Halbleiter, Juni 2009, S. 53-54
2009-06 (0,00MB)

• 功率模块的烧结技术   

C. Göbl
2009-04 (0,61MB)

• Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications   

Dr. U. Scheuermann
APEC 2009, Washington DC, USA
2009-03 (0,00MB)

• 用于电动和混合动力交通工具的功率模块   

Dr. Arendt Wintrich
2009-02 (0,64MB)

• Modular and Powerful Inverters up to 1MW   

Daniel Seng, Product Manager, SEMIKRON France
Power Electronics Europe, Issue 8 2008, p.p. 25-29
2008-12 (0,00MB)

• 用于三电平逆变器的IGBT   

Marco Di Lella and Riccardo Ramin, Product Manager SEMIKRON Italy
2008-09 (0,56MB)

• 尺寸不变，功率更强   

Dr. Volker Demuth, Product Manager
2008-07 (0,31MB)

• A new 3D power module packaging without bond wires   

C.Göbl, P. Beckedahl
PCIM 2008
2008-06 (0,00MB)

• First Intelligent Power Module for Solder-Free Assembly   

Markus Hermwille
Bodo's Power 05-2008, p.p. 14
2008-06 (0,00MB)

• Towards a clear signal   

Markus Hermwille, Thomas Grasshoff
EuE 05-2008, p.p. 2-5
2008-05 (0,00MB)

• 功率模块的封装和 一体化 封装   

Dr. Thomas Stockmeier
2008-05 (1,51MB)

• 驱动芯向全数字发展   

Markus Hermwille
2008-05 (0,73MB)

• 600V Converter/Inverter/Brake (CIB) - Module with integrated SOI Gate Driver IC for Medium Power Applications   

B. Vogler, M. Roßberg, R. Herzer, L. Reusser, T. Wurm, SEMIKRON Elektronik GmbH & Co KG Germany, TU Ilmenau Germany
CIPS 2008
2008-04 (0,00MB)

• Reliable Power Electronics for Windmill Generators   

D. Schreiber
Power Electronics Europe, Issue 2 2008, p.p. 16-18
2008-03 (0,00MB)

• Interview on Power Electronics for Windmill Applications   

D. Schreiber
Bodo's Power, March 2008, p.p. 24-25
2008-03 (0,00MB)

• The Road to the Next Generation Power Module - 100% Solder Free Design   

Dr. U. Scheuermann, P. Beckedahl
CIPS 2008; 5th International Conference on Integrated Power Electronics Systems, March 11-13 2008, Nuremberg / Germany
2008-03 (0,00MB)

• Reliability of spring pressure contacts under environmental stress   

F. Lang, Dr. U. Scheuermann
Proc. Microelectronics Reliability Volume 47, Issues 9-11, September-November 2007, p. 1761-1766 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
2007-11 (0,00MB)

• Electrical and thermal optimization of an automotive power module family   

Dr. A. Wintrich, P. Beckedahl, T. Wurm
October 24-25, 2007 – Paris
2007-10 (0,50MB)

• 600V SOI Gate Driver IC with Advanced Level Shifter Concepts for Medium and High Power Applications   

M. Roßberg , R. Herzer SEMIKRON, B. Vogler, TU Ilmenau
Paper EPE 2007 in Aalborg/Dänemark 09/2007
2007-09 (0,00MB)

• Long Term Reliability of Spring Pin Pressure Contacts in an Industrial Environment   

F. Lang, Dr. U. Scheuermann
Proc. CIPS 2006, C2-8, 105-110, Naples, 2006
2007-09 (0,00MB)

• Spring contacts - reliable alternative to critical solder contacts   

Daniel Seng, Product Manager, SEMIKRON Frankreich
Bodo´s Power Systems - August 2007, pp. 22-23
2007-09 (0,00MB)

• A new power module concept for automotive applications   

P. Beckedahl, T. Grasshoff und M. Lederer
PCIM Nuremberg 2007
2007-08 (0,00MB)

• 100%无焊接IGBT模块   

Ch. Daucher
2007-07 (0,81MB)

• IGBT4 Technology Improves Application Performance   

Ralph Annacker and Dr. Reinhard Herzer
Bodo´s Power Systems Juni 2007, p.p. 30-32
2007-06 (0,00MB)

• 随时可用的散热涂层   

Dr. Michaela Strube
2007-06 (0,51MB)

• Solder-Free Pressure Contact Modules for Automotive Applications   

Thomas Grasshoff, Christian Daucher
Power Electronics Europe 00 2006 S.1-2
2007-06 (0,00MB)

• Soft-Start Control of Electric Motors   

N. Schäfer and R. Herrmann
Power Electronics Europe JANUARY 2007, p.p. 26-29
2007-02 (0,00MB)

• Low temperature sinter technology   

C. Göbl, P. Beckedahl, H. Braml
Automotive Power Electronics 21-22 June 2006, S. 1-5
2006-12 (0,00MB)

• Control the Future New alternative materials and concepts for Power Electronics   

Peter Beckedahl, Thomas Graßhoff
ELEKTRONIKPRAXIS November 2006, p.p. 52-56
2006-11 (0,00MB)

• Starke Herausforderung, Leistungsbaugruppen für die Bedürfnisse der Automobilindustrie   

John Mookken, SEMIKRON USA
Elektronik JOURNAL 09/2006, S. 24-25
2006-09 (0,00MB)

• 单螺钉安装的SEMITOP功率模块的设计   

F. Brucchi, SEMIKRON Italia
2006-06 (0,82MB)

• The performance of new IGBT Chip Technologies - soft switching and low conduction losses for cost efficient inverter design   

T. Grasshoff, SEMIKRON Deutschland und D. Seng SEMIKRON Frankreich
Papers PCIM 2006 in Nuernberg, Germany
2006-06 (0,00MB)

• Influence of parameter distribution and mechanical construction on   

Dr. Arendt Wintrich, Jair Nascimento, Michael Leipenat
PCIM 2006
2006-06 (0,00MB)

• Packaging of Large Area Power Chips - Extending the Limits of Standard Module Technology   

Dr. U. Scheuermann, F. Ebersberger
Proc. CIPS 2006, C2-2, 69-74, Naples, 2006
2006-06 (0,00MB)

• Modular Approach Simplifies Power-System Design   

J. Mookken, K. Haddad, SEMIKRON USA
Power Electronics Technology, pp. 46- 49 05/2006
2006-06 (0,00MB)

• Reliability of Spring Contacts in Industrial Environments   

Florian Lang and Uwe Scheuermann
Power Electronics Europe Issue 6 2006, S. 22-25
2006-06 (0,00MB)

• SKiiP: Lifts Away, Reliability is a must   

Melanie Gill
Power Systems Design Europe May 2006, p.p. 38-41
2006-05 (0,00MB)

• New 1200V SPT + IGBT Chips in SEMiX Power Module Platform   

C. Daucher, A. Wahi, SEMIKRON Deutschland und D. Seng, SEMIKRON Frankreich
Power Electronics Europe Issue 4 2006, p.p. 28-29
2006-05 (0,00MB)

• 用于功率变换器的IGBT驱动核   

M. Hermwille
2006-03 (0,23MB)

• Power Modules   

J. Mookken, SEMIKRON USA
Electric & Hybrid Vehicle Technology 2005, p.p. 98-99
2006-02 (0,00MB)

• Networking in Overdrive, International centers for complete power sub-assemblies   

F. Sargos, International Coordinator Solution Centers Network and P. Newman, Managing Director, Solution Center SEMIKRON United Kingdom
2006-01 (0,00MB)

• Latch-up free 600V SOI Gate Driver IC for Medium Power and High Temperature Applications   

M. Roßberg, Dr. R. Herzer, SEMIKRON und S. Pawel, TU Ilmenau
EPE 05
2005-11 (0,00MB)

• Modular Inverters for high Power Applications   

P. Newman, Managing Director SEMIKRON United Kingdom
Power Systems Design Europe October 2005, p.p.14-18
2005-11 (0,00MB)

• 600V SOI Gate Drive HVIC for Medium Power Applications Operating up to 200°C   

M. Roßberg, Dr. R. Herzer, SEMIKRON und S. Pawel, TU Ilmenau
ISPSD 05
2005-11 (0,00MB)

• Packaging considerations of an Integrated Inverter Module (IIM) for Hybrid Vehicles   

P. Beckedahl, Dr. W. Tursky und Dr. U. Scheuermann
PCIM 2005 in Nuermberg
2005-07 (0,00MB)

• 未来汽车——开发下一代功率模块的动力   

John Mookken, SEMIKRON USA
2005-06 (0,29MB)