MiniSKiiP Technical Articles

• MiniSKiiP: Taking Power Density to a new Level   

Alexander Langenbucher
Bodo's Power Systems September 2011
2011-09 (0,18MB)

• 三电平逆变器 – 便利的在线尺寸计算 (SemiSel)   

Alexander Langenbucher, Ingo Staudt
2011-01 (1,82MB)

• Always one step ahead   

Michael Brunn, Editor-in-Chief E&E
E&E 08.2010
2010-12 (0,21MB)

• MiniSKiiP® IPM的尺寸仅为标准1200 V IPM的一半   

Musametin Zurnaci
2010-11 (0,16MB)

• 为了不同的心愿 - 得益于在可扩展电力电子器件在电驱动系统上的应用，降低了成本且减少了空间   

Thomas Grasshoff
2010-08 (0,50MB)

• Integration of 1200V SOI gate driver ICs into a medium power IGBT module package   

Bastian Vogler, Matthias Rossberg, Reinhard Herzer, Lars Reusser (SEMIKRON)
Article published at ISPSD in Hiroshima, June 2010
2010-07 (2,15MB)

• 处理导热涂层时如何避免错误   

Dieter Esau, Dr. Michaela Strube
2010-05 (0,64MB)

• 能量转换, 功率半导体产业的需求挑战   

Aseem Wahi
2009-09 (0,74MB)

• First Intelligent Power Module for Solder-Free Assembly   

Markus Hermwille
Bodo's Power 05-2008, p.p. 14
2008-06 (0,00MB)

• 600V Converter/Inverter/Brake (CIB) - Module with integrated SOI Gate Driver IC for Medium Power Applications   

B. Vogler, M. Roßberg, R. Herzer, L. Reusser, T. Wurm, SEMIKRON Elektronik GmbH & Co KG Germany, TU Ilmenau Germany
CIPS 2008
2008-04 (0,00MB)

• Reliability of spring pressure contacts under environmental stress   

F. Lang, Dr. U. Scheuermann
Proc. Microelectronics Reliability Volume 47, Issues 9-11, September-November 2007, p. 1761-1766 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
2007-11 (0,00MB)

• Long Term Reliability of Spring Pin Pressure Contacts in an Industrial Environment   

F. Lang, Dr. U. Scheuermann
Proc. CIPS 2006, C2-8, 105-110, Naples, 2006
2007-09 (0,00MB)

• 600V SOI Gate Driver IC with Advanced Level Shifter Concepts for Medium and High Power Applications   

M. Roßberg , R. Herzer SEMIKRON, B. Vogler, TU Ilmenau
Paper EPE 2007 in Aalborg/Dänemark 09/2007
2007-09 (0,00MB)

• 随时可用的散热涂层   

Dr. Michaela Strube
2007-06 (0,51MB)

• Control the Future New alternative materials and concepts for Power Electronics   

Peter Beckedahl, Thomas Graßhoff
ELEKTRONIKPRAXIS November 2006, p.p. 52-56
2006-11 (0,00MB)

• Latch-up free 600V SOI Gate Driver IC for Medium Power and High Temperature Applications   

M. Roßberg, Dr. R. Herzer, SEMIKRON und S. Pawel, TU Ilmenau
EPE 05
2005-11 (0,00MB)

• 600V SOI Gate Drive HVIC for Medium Power Applications Operating up to 200°C   

M. Roßberg, Dr. R. Herzer, SEMIKRON und S. Pawel, TU Ilmenau
ISPSD 05
2005-11 (0,00MB)