SKIN layer replaces wire bonds.
Chip sintering on both sides.
Sinter layer replaces thermal paste.
The solder layer between Cooler and
DBC as well as DCB and chip is
replaced by cold-welded silver bonds,
making the module 100% solder free.
Spring contacts replace solder pins and
provide electrical connection to the
The pressure contact technology
reduces the number of solder layers.
No copper base plate is needed.
Standard Technology with solder pins
and screw terminals.