Semikron Danfoss at PCIM Europe 2023

09 – 11 May 2023

You can find us at

Hall 7, Booth 7-422
Exhibition Centre Nuremberg
Messeplatz 1
90471 Nuremberg
Germany

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The Ultimate Partner in Power Electronics

A new leader in power modules – Semikron Danfoss – was established in August 2022 when SEMIKRON and Danfoss Silicon Power joined forces. With our combined strengths, we enable the green transition by investing significantly in innovation, technology, and capacity to enable customers’ future growth plan.

We can’t wait to showcase the strongest product portfolio in the industry at PCIM Europe. Come meet our experts in hall 7 at booth 7-422 and see how our solutions can strengthen your product – and while we wait for the doors to open on May 9th get a preview here.

Meet us at PCIm 2023

Our PCIM 2023 Highlights

Power Modules with ROHM 1200V RGA IGBTs

A True Alternative to Generation 7 IGBTs for Industrial Motor Drives

The worldwide growth in electrification technologies has created unprecedented demand for power modules. The chip supply often limits power module availability, and the sourcing situation remains tight. For this reason, Semikron Danfoss has partnered with ROHM to supply their new 1200V RGA IGBT. With a line-up of industry standard housings, there is now a true alternative to Generation 7 IGBT power modules.

Key Features

  • Newly designed 1200V, trench gate, light punch through IGBT with Tj,max = 175°C
  • Optimized for industrial drive applications in the low to medium power range
  • High peak current capability
  • Humidity-robust
  • Low thermal resistance
  • True multiple source alternative to Generation 7 IGBT equipped power modules

Watch the video

More about multiple sourcing

SKiiP® 7

Designed to Meet the Challenges

The new SKiiP 7 IPM generation enables customers to design converters with higher power ratings at the same or less volume and decreased price in relation to power density. Thanks to its modular design and the availability of both 6-pack and half bridge configurations with up to 6 power modules on one heat sink, the power range of SKiiP 7 is extremely wide: from 150kW to 2MW.

Product Features

  • 500A and 600A sixpack configuration
  • Easy paralleling
  • Optimized performance with state-of-the-art driver ASIC chip set
  • 100% tested including burn-in
  • Generation 7 IGBT/CAL4F chip set, humidity-robust
  • Sintered die connection
  • High-performance heat sink
  • High-performance thermal paste (HPTP)

Watch the video

More about SKiiP 7

Our PCIM 2023 Product Showcases

 

 

eMPack® Power Module

High-Performance Package for E-mobility

The transition from full vehicle platforms to full battery electric vehicle architectures is progressing rapidly. These architectures will require scalable power electronics solutions for electric drive systems (EDS) that are capable of covering a wide power range and are cost-effective at the same time, resulting in an important competitive advantage for vehicle manufacturers.

Semikron Danfoss' new power module platform eMPack, which is based on a common module concept, is being developed for EDS inverter architectures covering a power range from 100kW to 750kW. eMPack covers 400V and 800V battery system applications.

The combination of silicon carbide technology and Semikron Danfoss' fully sintered, low stray inductance Direct Pressed Die Technology (DPD) allows for unmatched power densities combined with high reliability for automotive applications.

Product Features

  • High-efficiency SiC technology
  • Ultra-low stray inductance
  • Superior reliability in a fully sintered package
  • Dedicated configurations for all BEV power ranges
  • Compact package

DCM™

Flexible Design through Customization

To power up the fast-growing fleet of PHEVs and BEVs, Semikron Danfoss has developed a power module technology platform for traction applications — DCM™.

The DCM™ technology platform is designed to be scalable. In the same package, we can scale the power up or down to meet different inverter voltage classes with blocking voltages of 750V-1200V, power of 150kW to 500kW with output currents ranging from 350 to 900A.

Furthermore, our power modules are based on quality components, patented packaging and cooling technologies to achieve outstanding, measurable results in terms of reliable performance and robustness – all adding up to deliver a cost-effective solution that lasts.

Product Features

  • Excellent flexibility in design, customized interfaces
  • Si IGBT and full silicon carbide MOSFET technology
  • Scalable across voltage classes
  • Advanced bonding technologies for superior power cycling robustness
  • High power density
  • Robust molded module packaging
  • Direct liquid cooling with ShowerPower® 3D
  • Multisourcing thanks to chip independency

SKAI® HV

Compact Power Converters for E-Mobility

SKAI HV comprises a versatile 3-phase converter platform designed for use in electrified vehicles. It covers key requirements such as high power density, exceptional ruggedness and automotive EMI compliance. The integrated motor control software SKAIware ensures highly efficient operation of the electric drive train.

Short Facts

  • Suitable for battery voltages up to 800VDC
  • Sintered power semiconductors
  • EMI compliant
  • Peak current 400Arms
  • Peak apparent power 300kVA

Product Features

  • Compact integration into IP67 enclosure
  • Voltage, current and temperature sensors
  • Gate driver with protection
  • IGBT power semiconductors
  • Fully programmable digital signal processor
  • EMI filters
  • Versatile cooling system (liquid-cooled, forced-air cooled, base plate)
  • DC-link capacitors
  • Motor control software

SKAI® LV

Ultra-Compact MOSFET Inverter Platform

The SKAI LV is a platform for low-voltage inverter systems for on and off-road applications. This platform constitutes the 3rd generation of low-voltage inverter systems and the 7th generation of MOSFET inverter technology developed by Semikron Danfoss, with more than 1.5 million MOSFET inverters in the field.

To create an optimized application-specific motor control system, simply integrate a customized control board. The SKAI LV platform is based on the same power technology found in high-voltage, high-reliability applications today, providing access to high-power, maximum reliability technologies across a wide range of low-voltage on and off-road applications.

Low-voltage MOSFET inverter system up to120V and 55kVA

  • For material handling and battery powered vehicles
  • Voltage, current and temperature sensors
  • Gate driver with protection
  • Low inductance, low-loss power section
  • DC link capacitors
  • Air and plate cooling
  • Easy-to-use gate driver interface
  • Platform for customised designs

Product Features

  • For compact designs
  • 30kVA/l power density
  • Vbattery: 24VDC up to 96VDC
  • 600Arms peak current during acceleration
  • Easy-to-use gate driver
  • IP66 enclosure

SEMITOP® E3

New Package for Baseplate-less PCB-based Designs

Baseplate-less modules have gained popularity in numerous power electronic applications. The new SEMITOP E3 is a seamless extension of our baseplate-less SEMITOP E product line and comes with the latest Generation 7 IGBT chips. It scales up the proven performance of SEMITOP E1/E2 to higher power motor drive designs, while still utilizing a printed circuit board for all electrical connections. The SEMITOP E3 is a fully compatible, 12mm-tall, industry standard package. With press-fit pins and pre-applied TIM, the SEMITOP E3 is a smart choice for a flexible, multiple source motor drive design.

Product Features

  • Baseplate-less design
  • Scalable PCB-based design concept for motor drives of up to 55kW
  • Industry standard footprint and pinout
  • Flexible pin grid for additional topologies
  • Optimised Press-fit pins (solder capable) for easier press-in/out
  • Available with pre-applied TIM

Product Offering

SEMITOP E3 power modules will be offered with converter-inverter-brake (CIB) and sixpack topologies for the 1200V class.

CIB configurations (“DGDL”) will be provided in 50A, 75A, and 100A nominal current ratings, allowing the design of compact drives of up to 30kW/400VAC using a single power module.

Sixpack configurations (“GD”) will be available with 100A, 150A, and 200A nominal current. With these packages, a PCB-based drive design can be scaled up to as high as 55kW/400VAC.

As with the SEMITOP E1/E2, SEMITOP E3 is available with pre-applied High Performance Thermal Paste (HPTP). Alternatively, for ease-of-handling during assembly, it also comes with pre-applied HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material.


Your Ultimate Partner for Silicon Carbide

Complement Silicon Carbide with Innovative Packaging

Semikron Danfoss has strong, long-term partnerships with all of the top silicon carbide chip manufacturers to make your supply chain more reliable. With robust packaging compatible with industry and automotive designs, we leverage our chip independence to supply the latest SiC technology.

From low to high power, Semikron Danfoss offers power modules for all industrial applications. The baseplate-less and flexible SEMITOP E1/E2 module family is our solution for compact EV charging, solar, energy storage and now, motor drives. For even higher power, the SEMITRANS 3, a 62mm-wide, baseplate module, is available in 1200V and 1700V half-bridge topologies.

For automotive traction applications Semikron Danfoss develops power modules for support of full battery electric vehicle architectures which require scalable power electronics. Both eMPack and DCM technology platforms are designed to cover a wide power range and are cost-effective at the same time. We offer solutions for applications from 100kW to 750kW, battery voltages 400V and 800V and output currents up to 900ARMS. Our products meet high reliability, performance and robustness targets, thanks to our solutions based on doubled sided sintering technology (DPD/DBB) and versatile cooling technologies.

Key Features

  • Industry standard SEMITOP E1/E2 and SEMITRANS 3 packages
  • Automotive grade eMPack and DCM solutions
  • Superior reliability in a fully sintered package
  • Dedicated configurations for all BEV power ranges
  • Compact packages
  • Ultra low stray inductance
  • Scalable across voltage classes
  • High power density
  • Application-specific module packaging technologies
  • Future-looking partnerships with SiC chip manufacturers with mutual technological development
  • Half-bridge, H-bridge, sixpack, double boost and 3-level topologies

Benefits

  • Multiple SiC chip sources ensure supply chain resilience
  • Industry standard pinouts make multiple sourcing easy
  • Advanced packaging technology takes full advantage of silicon carbide’s capabilities
  • Customized modules give users design flexibility

Watch the video

Learn more about SiC

Our PCIM 2023 Stage Presentations

How Energy Storage and EV Charging Trends Influence Power Electronics

Emiliano Meza
09 May 2023, 10:25 - 10:45
E-Mobility & Energy Storage Stage

In order to increase highway charging speed, electric vehicles are demanding increased power from DC chargers. However, installing multiple high-power chargers at a single station can mean adding megawatts of power. This addition can cause an increased burden to the electrical grid, often requiring costly infrastructure updates. Installing energy storage at charging stations reduces peak loads and balances the energy demand, reducing infrastructure additions. Power electronics bridge the connection between the grid, energy storage and EV chargers. This presentation shows how evolving trends in energy storage and EV charging, such as DC microgrids, heavy-duty vehicle charging and V2G technology, affect power electronics. Additionally, it explains how Semikron Danfoss supports customers in meeting these demands.

Learn more

Parallel Operation of Modules in ANPC Topology for Operation at 2.2kV DC

Dipl. Ing. Ingo Rabl
09 May 2023, 12:55 - 13:25
Industry Stage

The continuing trend towards higher DC link voltages on the one hand and higher power density on the other requires either high blocking semiconductors or special converter topologies. Semikron Danfoss has chosen a 3-level ANPC topology using standard 1700V semiconductors. This circuit allows DC voltage up to 2.2kV. An output voltage of 1400V results in a very high power density, which is further increased by means of a parallel connection of two modules. These measures allow a power of about 6MW. Due to its complexity, the particular challenge of this topology lies not only in the parallel connection but also in the insulation coordination, especially since only standard components or materials are to be used.

Learn more

True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM 1200V IGBTs

Stefan Häuser
10 May 2023, 10:00 - 10:20
Exhibitor Stage

In the wake of worldwide supply chain disruptions, purchasers and engineers alike have redoubled efforts to secure multiple sources for IGBT power modules. However, there are a limited number of power semiconductor chip manufacturers. For the latest industrial motor drive applications, up until now only so-called Generation 7 IGBT devices have been available. Semikron Danfoss has partnered with ROHM Semiconductor to supply a new 1200V RGA IGBT chip to diversify the supply chain. The conduction, switching, and thermal characteristics are optimized for motor drive applications in the low to medium power range. Testing shows that the RGA performs as well or better than Generation 7 IGBT devices. The RGA demonstrates advantages in thermal performance and ease-of-driving, making it the perfect alternative IGBT chip. Semikron Danfoss is offering a complete line of MiniSKiiP and SEMITOP E power modules with the 1200V ROHM IGBT.

Learn more

Advanced SiC Power Modules for Electric Vehicles
 

Dr. Ole Muehlfeld
10 May 2023, 10:30 - 10:50
E-Mobility & Energy Storage Stage

This presentation will introduce our product line-up based on two product families, DCM and eMPack, targeting the upcoming generations of EVs for global OEMs and Tier1. Our innovative packaging technology is dedicated to support full SiC drivetrains for 400V and 800V systems. The DCM1000/X and eMPack are suitable for high performance electric car and commercial vehicle applications. The newly developed DCM500 platform targets medium power classes with its compact size and high level of integration. With advanced die attach technologies like Danfoss Bond Buffer and Direct Pressed Die, along with direct cooling such as ShowerPower 3D or advanced closed heatsink structures, we push the boundaries of existing design limitations to make the most out of power semiconductors. Our chip independence allows customers to select chips that are most compatible with their vehicle platform. By offering DCM and eMPack modules, we support the industry's journey towards highly efficient drivetrains.

Learn more

SKAI 3 LV Platform – high-performance, high-reliability, ready to use

Dr. Lutz Görgens
11 May 2023, 10:55 - 11:15
E-Mobility & Energy Storage Stage

Semikron Danfoss offers a new and fast way for customers to create their own, optimized motor-controller for industrial and off-highway vehicles and other battery-powered machinery. The SKAI 3 LV inverter platform is a new product concept, designed to quickly develop a customized low-voltage motor-controller solution, without the effort of industrializing the overall mechanical power-electronics. With the power-technologies typically only available for high-power application, this platform offers high-performance, high-reliability ready to use. With more than 1.5 million units from this product family installed in vehicles, the technology has demonstrated its capabilities and reliability.

Learn more

Poster & Dialogue Session


TopicSpeakerLocation
Aging of SiC MOSFETS Through Multistep Voltage Gate Switching StressJorge MariA05-8267
A Fully Integrated LEM Nano Current Sensor for DCM Platform for High Power Density EV-ApplicationsFabio CarastroQ01-8263

Do you want to attend but can’t be there in person?

The PCIM Europe 2023 will be complemented by a digital platform with live streaming, on demand presentations as well as exhibitor and product profiles. You can find all information around the digital extension on the PCIM Europe 2023 website.