digital days 2021

3 – 7 May, 2021

About PCIM digital days

PCIM Europe digital days 2021 - the leading exhibition and conference for power electronics

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Register for PCIM digital days

PCIM Europe digital days is free of charge. Simply register on the PCIM Europe digital days website.

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SEMIKRON invites you

In 2021, PCIM Europe will take place in digital form from May 3 – 7, 2021. Further down below you will find all our forum presentations, the live webinars hosted by SEMIKRON and all our conference contributions to which we would like to invite you. Participation in the PCIM Europe digital days is of course free of charge. Simply register on the PCIM Europe digital days website and put together your individual conference program or arrange individual appointments with our experts. We look forward to welcoming you to our lectures and presentations.

Our E-Mobility Forum Presentations

eMPack® Power Module Family - Technology to Build Scalable and Highly Effcient Traction Inverters

Thursday, May 6, 2021, 10:25 - 10:55 (CEST)

Oliver Tamm 

Scalable, compact, highly reliable, efficient... these are some of the attributes passenger car manufactures require for e-drive system power electronics. Silicon Carbide (SiC) technology is the foundation for efficient power conversion but the specific features of SiC require an optimized module design with respect to electrical and thermal performance as well enhanced thermal cycling robustness. eMPack® power modules based on Semikrons fully sintered direct pressed technology (DPD) is addressing these requirements.

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Demonstrating the Benefits of eMPack® Modules Using eMPack® Application Kit

Thursday, May 6, 2021, 11:00 - 11:30 (CEST)

Ingo Rabl (SEMIKRON)

SEMIKRON's eMPack power modules are perfect for automotive e-drive systems. SEMIKRON's Application Kits offer an easy way to get started with the eMPack in a short time in the customer's lab. There is no need to think about technical details like optimized gate resistors or any other kind of adaptation of the driver board to the eMPack modules. Available for different semiconductor technologies and blocking voltages the Application Kits reduce the time to get started significantly and are hence the perfect tool to evaluate different power ratings and semiconductor technologies.

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Live Webinars hosted by SEMIKRON

Power Modules: Driving Tomorrow’s Smart Grid

Tuesday, May 4, 2021, 10:00 - 10:30 (CEST)

Emiliano Meza
Stefan Häuser (SEMIKRON)

The grid is changing from large, centralized power plants with passive loads to smaller, decentralized renewables with more active loads. With this more intelligent grid, power electronics driving the grid require higher efficiency and power density in a reliable package. During this PCIM webinar, SEMIKRON displays the latest developments enabled by generation 7 IGBTs and Silicon Carbide chipsets. For drives and UPS, SEMIKRON’s Generation 7 IGBT portfolio offers efficiencyin industrial standard packages. In applications requiring increased power density and efficiency, such as energy storage and EV charging, the latest SiC portfolio is now available. For Solar, achieve low cost and efficient designs by combining SiC and the latest IGBTs.

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Modules for High(er) Power Renewables and Drives

Wednesday, May 5, 2021, 10:00 - 10:30 (CEST)

Bernhard Eichler (SEMIKRON)
Emiliano Meza (SEMIKRON)

As the power of renewable applications grows, there is an increasing demand for high(er) power modules and IPMs. SEMIKRON presents their latest product line-up for renewable energies and high power drives in this webinar at PCIM Digital Days 2021. This webinar includes the increased power rating of SEMITRANS 10, the new SEMITRANS 10+ and the latest SEMITRANS 20 product family with highest power density, ideal for paralleling and scaling. The high power SKiiP 4 IPMs will also be showcased with the new High Performance Cooler.

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Our Conference Contributions

Topic Description Date Location

High Speed Hybrid Simulation Engine for Electrical Mission Profiles

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This paper describes a way how to combine two common simulation methods to create a new hybrid simulation engine that provides superior computation speed and simulation accuracy over the entire inverter output frequency range including 0 Hz. The hybrid simulation engine is implemented in the simulation program SemiSel V5. Example calculations demonstrate that the hybrid engine is up to 100 times faster than the conventional method, while offering a maximum of accuracy and numerical stability.

Martin Röblitz (SEMIKRON)
Christopher Schmidt (SEMIKRON)
Arendt Wintrich (SEMIKRON)

Tuesday, May 4, 2021
15:45 (CEST)
Stream 2

Modeling and Design

Chip Area Impact on Power Cycling Lifetime of IGBT Modules

Nominated for the Best Paper Award

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This work compares the lifetime of power modules assembled with IGBTs of varying area in power cycling tests with different load pulse durations. FEM simulations of the test structures reveal local temperature and stress evolution, which leads to distinctive degradation patterns. It is shown, that empirical lifetime models maintain validity for product families with similar architecture, when the chip type is replaced.

Fabian Nehr (SEMIKRON)
Marion Kind (SEMIKRON)
Marina Montaine (SEMIKRON)
Uwe Scheuermann (SEMIKRON)

Thursday, May 6, 2021
10:35 (CEST)
Stream 1

Power Cycling

Disruptive Approach of Additive Manufactured Electronics (AME)

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The Buzzword “3D printing” is discussed in recent days. Given the diversity of the whole industry, there is no “one-size-fits-all” solution. To exploit ideally resources within the Addtive Manufacturing Electronics (AME), the design has to be optimized. One approach is to use generative principles to reduce material. The second is, to print material vertical to optimize creepage distances. A third is to implement additional function for mounting. With an example of a MLI Power Stack application sampel, the benefits of AME should be shown.

Michael Schleicher (SEMIKRON)
Matthias Kujath (SEMIKRON)
Valentin Storz (Nano Dimension, IL)

Thursday, May 6, 2021
11:20 (CEST)
Stream 3
Special Session: Additive Manufacturing and Printed Electronics

Influence of Passive IGBT Control Scheme on Diode Recovery Behavior in Device Characterization Measurements

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Double pulse testing is commonly used for the dynamic characterization of power electronic devices. The approach implicitly assumes that switching events in double pulse testing and inverter operation are identical. This work shows that this assumption does not always hold. Surprisingly, in a half bridge configuration, the control scheme of the IGBT not under test determines whether a switching event during inverter operation is reproduced accurately, with significant influence on gate resistor selection, EMC, and switching energies.

Uwe Schilling (SEMIKRON)
Jürgen Engstler (SEMIKRON)
Peter Beckedahl (SEMIKRON)

Thursday, May 6, 2021
14:15 (CEST)
Stream 3

Advanced Si Devices I

About PCIM Europe

The PCIM Europe is the leading international exhibition and conference for power electronics and its applications. This is where experts from industry and academia meet, where new trends and developments are presented to the public for the very first time. In this way, the event mirrors the entire value chain – from components, drives control and packaging to the final intelligent system.