Same dimensions, smaller base plate / spring pressure contacts deliver better electrical properties / First module to feature the new protective packaging concept SEMiSEAL

SEMIKRON, one of the leading power semiconductor manufacturers worldwide and market leader in the area of thyristor/diode modules, has reduced the amount of materials used in its 6th-generation SEMIPACK modules and improved module protection thanks to its new packaging concept.  

The target applications for the thyristor, thyristor/diode or diode modules are input rectifiers (single-phase, three-phase, non-controlled, semi-controlled or fully-controlled) for frequency inverters or UPS systems, lighting control systems in theatres and temperature control systems in furnaces.  

The thyristor-diode module SEMIPACK 1.6 uses less material and includes a fundamental change to the design of the internal module structure. This module now features spring pressure contacts, meaning chips can now be freely positioned on the substrate and additional internal connections are no longer needed, improving reliability substantially. In addition, the heat management in the electronic packaging concept has been optimised, the result being the elimination of materials and solder layers and a clear reduction in thermal resistance Rth. This means that the maximum continuous current of the SEMIPACK 1.6 is greater than in the previous-generation SEMIPACK 1.5. In thyristor modules the mean forward current was increased to 119A@TC=85°C, sin180° (+12%); in diode modules to as much as 134A@TC=85°C, sin 180° (+34%).  

SEMIKRON has also introduced its new protective packaging concept SEMiSEAL in the SEMIPACK 1.6. The new packaging protects power modules by vacuum-sealing them between a plastic film and paperboard. The modules are automatically seal-packed once they reach the end of the production line and the final quality check has been done. The modules are thus reliably protected from harmful environmental influences such as contamination and humidity. SEMiSEAL thus helps ensure that modules are transported and stored safely, improving overall product quality.


SEMIKRON is a leading global power semiconductor manufacturer. The German-based family enterprise employs 3900 people worldwide. A global network of 36 companies with production plants in Brazil, China, France, Germany, India, Italy, Korea, Slovakia, South Africa and USA guarantees fast and competent on-site customer care.

SEMIKRON is a one-stop provider of chips, discrete semiconductors, transistor, diode and thyristor power modules, power assemblies and systems for markets such as industrial drives, wind and solar, hybrid and electric vehicles, the rail industry and power supply systems.

SEMIKRON is the market leader in the field of diode/thyristor semiconductor modules, enjoying a 30% share of the worldwide market. (Source: IMS Research, The World Market for Power Semiconductor Discretes & Modules – 2011 Edition). Our dedication to the hybrid and electric vehicle market is evident in the development and production of power semiconductors for this market, as well as in the majority take-over of Compact Dynamics GmbH, a development specialist for innovative control systems, the joint venture with drivetek, a provider for application-specific control technology, and the take-over of VePOINT, developing and producing inverters, DC/DC converters and chargers.

Recently, SEMIKRON introduced a revolutionary packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN Technology is based on the use of a flexible foil and sintered connections rather than bond wires, solders and thermal paste. This results in a higher current carrying capacity and 10 times the load cycle capability – unthinkable with the restrictive wire bonding used in power electronics in the past. This enables a reduction in converter volume by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.