Nuremberg, Germany, May 20th 2014 - SEMITOP® Press-Fit expands the SEMITOP® product family as an alternative concept to solder mounting. Press-Fit mounting ensures easy and fast mounting of the module and PCB in one step, reducing the assembly time and cost by eliminating the solder process. The 100% pin-out compatibility to the soldered version provides a user-friendly press-fit interface. Moreover, the SEMITOP® Press-Fit modules are characterized by the same electrical and thermal performance as the existing solder version, making the  switch to press-fit mounting technology most easy with the SEMITOP® product family.

SEMITOP® Press-Fit is an isolated power module based on baseplate free technology with only one mounting screw for heat sink fixing. The pressure technology concept and the single mounting screw guarantees a low thermal resistance and reduced mechanical stress for high reliability. The one-screw mounting concept offers the most easy mounting concept for a fast, reliable and low cost assembly as competition modules may require two or even more  mounting screws. The outstanding product reliability is  tested and confirmed by SEMIKRON’s extended qualification program consisting of as much as 17 different qualification and reliability tests. Some of these exceed industrial standards with a duration of more than 2500h.

A large variety of configurations with different chip technologies is possible inside SEMITOP®4 (60x55mm2), SEMITOP®3 (55x31mm2), and SEMITOP®2 (40,5x28mm2) Press-Fit cases. New high performing configurations such as 3-level inverter (NPC) and mixed 3-level inverter (TNPC), double boost and interleaved boost applications are available. As well as the standard and consolidated configurations like 3-phase inverter, converter-inverter-brake solutions, Mosfet configurations, 3-phase bridge rectifiers.

With only 12mm height, the SEMITOP®  is one of the most compact isolated power modules on the market for the low and medium power range from some kW up to 60kW output power. Supported by the flat and compact module design, the SEMITOP is characterized by a low module inductance. The excellent pin-out flexibility offers additional degrees of freedom for performance-optimized PCB layouts. High integration level philosophy in combination with the availability of the latest Si and SiC chip technology, make the  SEMITOP® product family suitable for competitive, innovative and future proof designs in markets such as  UPS, solar, motor drives and welding.

The SEMITOP® Press-Fit will be available by week 20 as released product. Currently two pilot customers are testing the platform with successful results and one is ready to start mass production by the second half of 2014.

Photo: SEMITOP® Press-Fit


SEMIKRON is one of the world's leading manufacturers of power modules and systems. Its products are at the heart of modern energy efficient motor drives and industrial automation systems. Further application areas include power supplies, renewable energies (wind and solar power) and utility vehicles. SEMIKRON's innovative power electronic products enable its customers to develop smaller, more energy efficient power electronic systems. These systems in turn reduce the global energy demand.

SEMIKRON is a family owned business founded in 1951, headquartered in Nuremberg, Germany. Today it has more than 2,800 employees in 30 subsidiaries world-wide. The international network of operational companies with production sites in Brazil, China, France, Germany, India, Italy, Korea, Slovakia, South Africa, and the US ensures fast and comprehensive service for customers. SindoPower as a SEMIKRON-Group company serves customers world-wide with a B2B power electronics online portal, multi-language sales and technical support and eCommerce.