Power Electronics for
Energy Storage Systems
Our solutions for energy storage systems
Power Electronics for Energy Storage Systems
With decentralized renewable energy sources in our power grid, the demand for energy storage systems to stabilize fluctuations is quickly growing. SEMIKRON’s portfolio includes a wide range of products for energy storage systems. From small and medium power modules for residential and industry scale storage systems to high power components for utility-grade storage systems.
SEMIKRON products deliver maximum reliability, meeting the extended lifetime requirements of energy storage systems. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – SEMIKRON has the solution.
The Latest Generation 7 IGBT for Highest Supply Chain Safety
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
For ANPC topologies, SEMIKRON’s new SEMITRANS 20 power module combines low stray inductance, high power density and Generation 7 IGBTs to set a new benchmark. This package design, based on standard half-bridge topology, allows a simple ANPC layout with low inductance DC-link connections.
Reduced system cost thanks to 3-level-topology
Comprehensive Sixpack and 3-Level Module Family
With its comprehensive portfolio and its optimised design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. Adapter boards for easy gate drive integration are also available.
The internal chip layout is optimised for enhanced thermal performance, reducing operating temperatures, thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
- Low stray inductance package
- Solder-free assembly
- Optimized thermal performance
- Flexible architecture
- Press-fit design
- 17mm module height
Exceeding the standardMore about SEMiX 5
SEMITOP® E1/E2Exceeding the standard for superior performance
MiniSKiiP®Solder-free spring technology for minimum assembly time
SEMiX® 5Extended standard for superior thermal and dynamic performance
SEMiX® 3 Press-FitExceeding the standard for superior performance
SEMITRANS®The proven power electronics package
SEMITRANS® 10Robust high power module
SEMITRANS® 20The new standard in high power
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 1000V. Our standard stacks cover an output current range from 70A to 4000A.More about Power Electronic Stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Product Portfolio IGBT Driver
Above the Standard
SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
SEMIKRON’s IGBT drivers are available as two-channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
SEMIKRON’s SKYPER and SKHI are well-known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
- Reinforced insulation for signal and power transmission
- Two-channel driver
- Up to 1700V transients
- Up to 1500V continuous DC bus voltage
- 8Apk to 35Apk per channel
- 1W to 4.2W peak per channel
- Suitable for multi-level topologies and Generation 7 IGBT
Adapter Boards and Application Samples
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs