Power Electronics forWind Turbines
Our solutions for wind energy
Customer service
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Power Electronics for Wind Turbines
SEMIKRON’s portfolio includes a wide range of products for wind energy applications, from small to medium power modules for pitch and yaw drives to high power components for multi-megawatt power converters. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – SEMIKRON has the solution.
The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. SEMIKRON has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters.
SEMIKRON products offer maximum reliability for on and offshore wind turbines both in industry standard packages and in high power SKiiP 4 IPMs and power electronic stacks.
Performance Range
Operation & Maintenance
Wind Turbine O&M
Today, more then 350,000 wind turbines are in operation in the field world-wide. The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. SEMIKRON has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters. From individual power modules, IPMs and drivers to dedicated, customized retrofit stacks – SEMIKRON has the right solution!
Benefits
SEMIKRON offers a broad portfolio with industry standard power modules such as the SEMITRANS and SEMiX family. It includes SKiiP IPMs with customized coolers to fit into your wind turbine converter. The range is rounded off with highly reliable stacks based on solder-free SKiM 93 modules featuring sintered chips. This technology allows for optmimized thermal conductivity from chip to heatsink and runs the chip at about 20°C lower than the OEM stack. SEMIKRON also offers newly designed driver boards based on the latest SEMIKRON ASIC technology with digital signal transmission and additional protection functions.
Key Features
- Broad portfolio of industry standard modules
- SEMIKRON advanced power modules for maximum reliability and efficiency
- Customized stacks for dedicated wind turbine converters
- Customized heatsinks for IPMs (SKiiP) for integration into converters
- Drivers and adapter boards with highly reliable SEMIKRON ASIC technology
New Benchmark Generation 7 IGBT
Pushing Performance in 3-Level Topologies
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
SEMITRANS 10 MLI enables wind turbine converters to reach voltage ranges up to 1000VAC (1500VDC) in 3-level NPC topology and increases converter efficiency.
Key Features
- Reduced system cost thanks to 3-level topology
- Up to 1.5MW without paralleling
- Lower switching losses thanks to 1200V IGBT
- Generation 7 IGBTs
- Lower THD means lower filter requirements
- Reduced cable diameters or cable losses
- Reduced cooling requirements
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air- or water-cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High performance cooling technology will be gradually introduced providing approximately 20% more output capability compared to standard water cooling.
Key Features
- 1200V and 1700V
- Half-bridge and sixpack
- 500A to 3600A
- Flexible cooling options: air, water or customized cooling options, high performance cooling
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver IGBT- and SiC-based stacks for AC voltages from 380V to 1000V. Our standard stacks cover a output current range from 70A to 1000A. Our new SEMIKUBE MLI brings all benefits of 3-level topologies in an off-the-shelf product. It includes all safety and sensing measures for your fast time-to-market.
- Water-cooled IGBT Stacks
SEMIKUBE MLI
SEMISTACK RE
Customised stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 15 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silk screen and stencil printing line.
For each requirement SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change mate- rials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate- less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimised TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
