Power Electronics for
Our solutions for electric and electrified vehicles
Power Electronics for Vehicles
Electrical vehicles require highly reliable power electronics for the electrical drive system. SEMIKRON, a leading supplier of power electronics, has been supplying products to the EV markets for more than 10 years. From chips and modules to entire converters, the full range of SEMIKRON products can be found in passenger cars, trucks, buses, industrial and light electric vehicles.
Power modules for auxiliary applications such as DC/DC converters, fuel cell compressor inverters, or exciter functions for drive systems need reliable solutions in small footprints. For these applications, SEMIKRON’s SEMITOP E1/E2 series offers flexible solutions tailored to the individual requirements.
High-Performance Power Electronics – Our Commitment to eMobility
SEMIKRON offers products for every possible application in the automotive environment. Our dedicated automotive portfolio includes power modules and integrated converter/inverter systems.
SEMIKRON modules are already in use in electric vehicles today. The SEMiX baseplate modules are popular with leading Chinese passenger car manufacturers. For higher power densities, the established baseplate-less module SKiM 63/93 is the first choice for electric and plug-in electric vehicles. This module has propagated widely through applications such as passenger cars, trucks and buses worldwide. Our power modules are also suitable for non-traction applications such as DC/DC converters or pumps used in fuel cells.
Alongside the main vehicle categories, SEMIKRON modules can also be found in motorcycles as well as agricultural and construction vehicles.
The Semikron converter/inverter system SKAI 2 HV for up to 850VDC bus is a high level integration system that combines typical SEMIKRON module performance with a matching controller and software system. The SKAI 2 HV is widely accepted and used as a traction inverter in various bus and truck series as well as in agricultural and construction vehicles all over the world.
The SKAI 3 LV converter/inverter system represents the low-power low-voltage end of SEMIKRON’s auto-motive solutions. Its compact dimensions have enabled it to meet industrial forklift truck applications. It is equally well suited to other industrial or on-road vehicles. The SKAI 3 LV also forms the perfect base for customized solutions for mild hybrid vehicles using 48VDC bus systems.
With the new power module concept eMPack, SEMIKRON is breaking the limits of existing power module technologies delivering more power, wider flexibility and all in a smaller footprint.
Outlook New Product Concept eMPack®
Pioneering the Future of eMobility with High-Performance Power Electronics
The transition of complete car platforms to full electric battery vehicle architectures is progressing rapidly. These architectures will demand scalable power electronics solutions for electric drive systems (EDS) that are capable of realizing a wide performance range in an economic way, resulting in an important competitive advantage to vehicle manufacturers.
SEMIKRON’s new power module platform eMPack, which is based on a single module concept, is being developed for EDS inverter architectures covering a power range from ~50kW up to ~750kW.
The combination of Silicon Carbide technology with SEMIKRON’s fully sintered, low stray inductance Direct Pressed Die Technology (DPD) enables unmatched power densities combined with high reliability for automotive application.
- Silicon Carbide MOSFET and Silicon IGBT options
- 750V/1200V compatible package delivering up to 900Arms
- Double Sided Sintering package enabling automotive grade reliability
- Low thermal resistance thanks to DPD technology
- Flexible cooler arrangements
- ~2.5nH package stray inductance (incl. terminals)
- Simplified mounting concept (all from top)
SEMiX® 5Extended standard for superior thermal and dynamic performance
SEMiX® 3 Press-FitExceeding the standard for superior performance
SEMITOP® E1/E2Exceeding the standard for superior performance
SEMiX® SPRINGExcellent cost/performance ratio
Product Portfolio On-Road Systems
Most Compact Power Electronic System Off-the-shelf for Electro-Mobility
SKAI 2HV comprises a versatile 3-phase AC/DC and DC/AC converter product platform designed for use in electrified vehicles. It covers key requirements such as high power density, exceptional ruggedness and automotive EMI compliance. The integrated motor control software SKAIware ensures highly efficient operation of the electric drive train.
- Compact integration into IP67 enclosure
- Voltage, current and temperature sensors
- Gate driver with protection
- IGBT/ MOSFET power semiconductors
- Fully programmable digital signal processor
- EMI filters
- Versatile cooling system (liquid cooled, forced air cooled, base plate)
- DC link capacitors
- Motor control software
The SKAI power electronic platform comprises highly integrated motor controllers which provide the ideal powertrain solution for mobile electric and hybrid applications. Power densities of up to 24kVA/liter bring about notable size reductions compared with other existing standard motor controller products. The systems are designed to operate with supply voltages of 24VDC to 850VDC and with output power ratings of up to 300kVA. The IGBT based SKAI 2 HV motor controller operates on sintered, 100% solder free 600V or 1200V power semiconductors and it features polypropylene film DC-link capacitors. It is integrated into a waterproof IP67 enclosure. The compact motor controllers can withstand high vibration amplitudes of up to 10g rms.
SKAIware motor control software adds to the system function and finishes off this tried-and-tested package for the SKAI 2HV nicely. SEMIKRON provides engineering services to support customers with the integration of SKAI 2HV motor controller systems. Other available services include, for instance, lifetime estimation, field application support, individual parameterization of motor control software, and more.
Versatile SKAI 2 HV off-the-shelf versions are available. Cooling methods are liquid, forced air cooling or baseplate. Various optional services also exist, such as end-of-line flashing of customer specific software, lifetime estimation based on application profile analysis, field application support, individual parameterization of motor control software and further services (on request).More about SKAI 2 HV
Product Portfolio for Off-Road Systems up to 48V
Ultra Compact MOSFET Inverter Platform
SKAI 3 LV is the 3rd generation of industrial MOSFET inverters and constitutes the 7th generation of MOSFET inverter technology manufactured by SEMIKRON, with more than 1.5 Million MOSFET inverters in the field. The 3rd generation is a platform concept that offers standard design versions or can be customised to meet your needs. The converter connects easily to a customer control board for quick and easy designing, while leaving the control to the customer.
3-phase MOSFET inverter system up to 55kVA
- For compact designs
- 30kVA/l power density
- Vbattery: 24VDC up to 160VDC
- 600Arms peak current during acceleration
- Easy-to-use gate driver
- IP66 enclosure
Direct Pressed Die Technology
A Breakthrough in Power Electronics Packaging
Since SEMIKRON introduced sintering technology in power electronics in 2009, it has been continuously enhanced breaking one technology limit after the other. Direct Pressed Die is the latest innovation combining unreached reliability with ultra-low Rth.
Single Sided Sintering Technology
Single Sided Sintering (SSS) technology utilises a highly reliable silver sinter layer to connect the chip to the ceramic substrate (DBC), replacing the standard solder layer.
Double Sided Sintering Technology
In Double Sided Sintering technology (DSS) two sinter layers are used: the chip is sintered to the DBC and a flex layer is sintered on top of the chip. The flex layer replaces the wire bonds, resulting in maximum reliability and current capability.
SKiN® Technology inside
SKiN technology is based on Double Sided Sintering. It also integrates the heatsink using a third sinter layer. SKiN technology is free of bond wires, thermal grease and solder, combining maximum reliability with minimum thermal resistance.
Direct Pressed Die Technology TM
Direct Pressed Die (DPD) technology includes a Double Sided Sintered (DSS) chip on a ceramic substrate that is pressed onto the heatsink by a defined force directly on top of the chip. This optimises reliability and thermal resistance, combined with flexibility with regard to cooling and integration in standard power modules.