Power Electronics for
UPS Systems
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Power Electronics for UPS Systems
The availability of infrastructure systems strongly depends on reliable power supplies, irrespective of whether these systems are servers and cloud storage systems, critical traffic control or hospital services.
Uninterruptable power supplies (UPS) ensure continuous operation of these critical systems. In SEMIKRON power modules, flexible topologies equipped with the latest IGBT and diode chips ensure maximum conversion efficiency for double conversion UPS systems. This efficiency can be further improved using Silicon Carbide technology.
Performance Range
Product Highlights
Compact and Efficient 100kVA Systems
UPS solutions for data centres today are based on modular UPS systems. In these systems several independent UPS modules in 19’’ frames are paralleled with single modules up to 100kVA. This achieves high scalability and easy implementation of redundancy.
The MiniSKiiP UPS power modules are available as symmetrical boost for the input stage and 3-level NPC topology for the output side. Both are based on fast swiching 650V IGBTs to allow high switching frequency and high efficiency at the same time, up to 100kVA output power. Optional Silicon Carbide components can increase efficiency even further.
- High power density thanks to MiniSKiiP UPS Power Modules
- Designed for small power and 19’’ based modular UPS systems with 100kVA
- Based on 650V IGBTs and Diodes, supporting up to 900V, optional Silicon Carbide components
- High power density system
- Easy mounting with just 2 screws per module thanks to SPRiNG technology, no soldering, not press-in process
Most Comprehensive UPS Portfolio
Highest UPS Power Density with SEMiX 5
With its comprehensive portfolio and its optimised design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. An adapter board for easy gate drive integration is also available.
The internal chip layout is optimised for enhanced thermal performance, reducing operating temperatures and thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
High power density thanks to comprehensive portfolio
- Biggest range of NPC and TNPC up to 400A nominal current
- Exceeding the standard: higher power density thanks to higher nominal currents in the same package
- Full range of symmetrical boost portfolio for input and battery charging
- Ready to use 3-level stack designs and application samples up to 500kW
Intelligent Power Modules – IPMs
The Most Powerful IPM in the Market
The SKiiP IPMs set a benchmark for high performance and robust Inverter designes. Especially the SKiiP 4 with its sintered chips is an enabler for maximum load cycle capability and lifetime for use in traction applications. With its solder-free power circuit and the ASIC based driver, the SKiiP 4 IPM stands for high reliability as no other high power IPM.
The power semiconductors used in SKiiP 4 modules can be operated up to a junction temperature of 175°C. To make sure these components can be reliably used at these temperatures, the power circuitry is 100% solder-free. Sinter technology is used to create a sintered silver layer instead of the solder layer which could limit the service life of power modules. Reliability during active and passive thermal cycling is greatly improved.
The integrated gate driver in the SKiiP 4 sets new standards in terms of reliability and functionality. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. This means the user no longer has to introduce complex and costly topology components to provide safe isolation.
Key Features
- 1200V and 1700V
- Half-bridges and sixpacks
- 1800A to 3600A
- Flexible cooling options: air, water or customized cooling options
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.
- Water-cooled IGBT Stacks
SKiiPRACK - Air-cooled IGBT Stacks
SEMIKUBE
SEMIKUBE SlimLine - Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C
Customised stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 15 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silk screen and stencil printing line.
For each requirement SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change mate- rials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate- less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimised TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
