Power Electronics for
Solar Inverters
Our solutions for solar energy
Customer service
Product service
Power Electronics for Solar Inverters
SEMIKRON’s portfolio includes a wide range of products for efficient solar inverters in all power ranges: residential, industrial and utility scale applications. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – SEMIKRON has the solution.
SEMIKRON offers a large portfolio of 3-level modules, IPMs and power electronic stacks which can reduce system costs significantly as well as optimize annual energy production, especially for increased DC voltages of up to 1500VDC.
Performance Range
Technology Highlight
The Latest IGBT Generation from Two Suppliers for Highest Supply Chain Safety
SEMIKRON has introduced 950V and 1200V Generation 7 IGBTs from two different manufacturers. Both Generation 7 IGBTs have fundamental improvements over the previous versions. Thanks to a new chip design, the chip size is an average of 25 % smaller across all current classes. This technology allows higher current density and an approximately 20% reduction in saturation voltage Vce,sat.
This new chip generation allows for compact inverters with unprecedented power density. Especially the new 950V IGBTs, in avariant for high switching frequencies as well as a variant with optimized Vce,sat, are ideally suited for use in 3-level topologies up to 1500VDC.
Additionally the Generation 7 IGBTs share the following features:
- 20% lower on-state voltage Vce,sat
- Operation junction temperature of 175°C during overload
- About 25% smaller chip size
- Optimized 950V chipset for 1500VDC 3-level topologies
Product Highlights
Generation 7 IGBT Power Modules
The Power Density Master: New Levels Utilizing the Latest Generation 7 IGBT Chips
For increased power density and high reliability, SEMIKRON now utilizes 950V IGBTs in the MiniSKiiPs. With this Generation 7 IGBT chip, both boosters and 3-level topologies have been optimized for the 1500VDC market. Along with the existing portfolio, the MiniSKiiP provides a power dense design for the string inverter market up to a power range of 300kW without paralleling of modules.
Key Features
- Low stray inductance case
- Solder-free assembly
- Optimised thermal performance
- Flexible architecture
- Available with Si, SiC and Si/SiC Hybrid
Comprehensive 3-Level and Booster Module Family
The SEMITOP E1/E2 packages provide supply chain security with a standard industrial design. Press-fit pins offer reduced manufacturing time and a low inductance design. Ideal for fast switching chips, such as SiC, the SEMITOP has a wide portfolio of topologies, ready for your string inverter design. The SEMITOP E1/E2 family also includes latest 950V and 1200V Generation 7 IGBTs.
Key Features
- Low stray inductance case
- Solder-free,
- press-fit assembly
- Optimised thermal performance
- Flexible architecture
- Available with Si, SiC and Si/SiC Hybrid
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air-or water-cooling, also with customized heat sinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High performance cooling technology will be gradually introduced providing approximately 20% more output capability compared to standard water cooling.
Key Features
- 1200V and 1700V
- Half-bridge and sixpack
- 500A to 3600A
- Flexible cooling options: air, water or customized cooling options, high performance cooling
- Paralleled operation for even higher output power possible
- Special version for 1500VDC available
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.
- Water-cooled IGBT Stacks
SKiiPRACK
SEMIKUBE MLI - Air-cooled IGBT Stacks
SEMIKUBE
SEMIKUBE SlimLine - Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C
Customised stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 15 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silk screen and stencil printing line.
For each requirement SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change mate- rials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate- less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimised TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
More about Thermal Interface Materials
More about Thermal Interface Materials