TP(HALA P8) SEMiX 3p

Thermal Interface Materials
SEMiX 3p

Part Number 12281241
TiM
material
HALA TPC-Z-PC-P8
Weight in mg 250
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production

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SEMIKRON SEMiX 3p
SEMIKRON inhomog. honeycomb structure

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TP(HALA P8) SEMiX 3p Features

• Inhomogeneous honeycomb structure

• Optimized layer thickness

• Enhanced heat dissipation

• High process reliability due to

automated screen/stencil printing

process

• Phase Change Material

TP(HALA P8) SEMiX 3p Target Applications

Additional Searches

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