TP(HPTP)Mini2II.Gen

Thermal Interface Materials
MiniSKiiP II 2

Part Number 12281100
TiM
material
High Performance Thermal Paste
Weight in mg 605
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production

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SEMIKRON MiniSKiiP II 2
SEMIKRON inhomog. honeycomb structure

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TP(HPTP)Mini2II.Gen Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

TP(HPTP)Mini2II.Gen Target Applications

Additional Searches

TP(HPTP)Mini 2II.Gen, TP(HPTP)Mini2 II.Gen, TPHPTPMini2IIGen, TPHPTPMini 2IIGen, TPHPTPMini2 IIGen