TP(P12)Mini3 GB

Thermal Interface Materials
MiniSKiiP II 3

Part Number 12280891
TiM
material
Wacker P12
Weight in mg -
Thickness (after assembly) in µm 35
Tolerances (+/-) in µm 6
Product Status In production

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SEMIKRON MiniSKiiP II 3
SEMIKRON honeycomb structure

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TP(P12)Mini3 GB Features

• Honeycomb structure

• Optimized thickness of thermal paste

layer

• Enhanced heat dissipation

• High process reliability due to

automated screen printing process

TP(P12)Mini3 GB Target Applications

Additional Searches

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