Power Electronics forDC Fast Chargers
Our solutions for EV chargers
Power Electronics for DC Fast Chargers
As electric vehicles become widespread, so must the infrastructure to charge them. One of the main requirements for the widespread use of electric vehicles is an accessible EV charging infrastructure. Governments and industries worldwide are preparing to invest in charging infrastructures.
Availability and costs are the key to success in the fast growing EV Charger market. As the specialist in power electronics, we use state-of-the-art topologies featuring standard components, guaranteeing both excellent efficiency and availability. SEMIKRON offers a comprehensive portfolio of products that meet the needs of fast charge equipment from as little as 8kW up to the megawatt range.
Industrial Standard Combined with Superior Performance
DC Fast Chargers require a power dense PFC, DC/DC, and output rectifier, all available in the SEMITOP E1/E2 packages. With a low inductance design, fast switching Si and SiC chips may be used to their full potential. Achieve supply chain safety with this industrial standard module in a wide array of topologies.
- Low inductance package
- Multiple sourcing down to chip level
- Optimized footprint
- Flexible architecture
- 2-screw concept
- Press-Fit terminals
- 12mm module height
- No baseplate
The thermal resistance is up 20% lower than the closest competitor using standard thermal paste. Using High Performance Thermal Paste (HPTP), a further 25% reduction is possible.More about SEMITOP E1/E2
Modular and Flexible Power for Your Charger Portfolio
The 50kW PowerCell is a full power converter including PWM controller and filters. With a modular design, the PowerCell may be paralleled to 350kW and beyond. The output voltage can seamlessly change between 500VDC and 1000VDC to meet any power requirement in the market.
- 50kW rated power
- 500VDC or 1000VDC Isolated output
- Scalable for high power charging
- CANopen communication protocol
- Easy integration and maintenance – all connections at the front
- Parallel operation for high power charging
- Integrated transformer for safe galvanic isolation
SEMIPACK®Bipolar modules from the market leader
SEMiX® 3 Press-FitExceeding the standard for superior performance
SEMiX® 5Extended standard for superior thermal and dynamic performance
SEMITRANS®The proven power electronics package
SKiM® 63/93High reliability design using sinter technology
SEMITOP® E1/E2Exceeding the standard for superior performance
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.More about Power Electronic Stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success:
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Product Portfolio IGBT Driver
Above the Standard
SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
SEMIKRON’s IGBT drivers are available as two-channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
SEMIKRON’s SKYPER and SKHI IGBT drivers are well known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
- Reinforced insulation for signal and power transmission
- Two-channel driver
- Up to 1700V transients
- Up to 1500V continuous DC bus voltage
- 8Apk to 35Apk per channel
- 1W to 4.2W peak per channel
- Suitable for multi-level topologies and Generation 7 IGBT
Adapter Boards and Application Samples
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs