Power Electronics for
Motor Drives

Our solutions for motor drives

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Power Electronics for Motor Drives

Since the first appearance of motor drives, SEMIKRON has been committed to supplying solutions for every power range. Starting with the first insulated power module, the SEMIPACK rectifier module series more than 40 years ago, the MiniSKiiP in particular has revolutionised the motor drive design for low and medium power systems.

Today SEMIKRON offers the complete industrial standard power module portfolio that serves a power range of 0.2kW to several megawatts. The portfolio is completed with high power IPMs, power electronic stacks and a comprehensive product line of driver electronics that help to reduce development effort and time-to-market. The latest Generation 7 IGBTs of two different suppliers, optimized for motor drive applications, boost performance and power density of motor drive converters.

Performance Range

Technology Highlight

The Latest IGBT Generation from Two Suppliers for Highest Supply Chain Safety

The Generation 7 IGBT chips T7 and M7 enable higher power density and higher performance. Thanks to a new IGBT cell design technology the chip size could be reduced by approximately 25% compared to the previous generation.

The features translate into up to 20% higher output power in given power package. Thanks to the higher allowed operation temperature an overload of e.g. 110% can be covered without the need of additional design reserves.

Additionally the Generation 7 IGBTs share the following features:

More about IGBT Generation 7

IGBT Generation 7 – The New Workhorse in the Power Electronics World

Product Highlights

The Power Density Master: New Levels Utilizing the Latest Generation 7 IGBT Chips

One continuous mounting concept from 0.4 to 110kW

One continuous module concept for all voltages and topologies

First SEMIKRON module to provide Generation 7 IGBT

More about MiniSKiiP

IGBT and Rectifier Module Family for Complete Motor Drive Solutions

The SEMiX 3 Press-Fit module family features IGBT and rectifier modules in the same housing design for a complete medium/high power drive solution. As an industry standard power module available with the latest generation IGBT chips from different suppliers, it gives a full supply chain safety.

It‘s your choice: SEMiX 3 Press-Fit is available with optional ...

... integrated current measurement shunts. The integration of the current measurement into the power module replaces expensive and bulky current sensors (i.e. Hall sensors) . This reduces size and cost of the motor drive system

... Plug-and-Play driver SKYPER 12 Press-Fit. Simply pressed onto the power module‘s press-fit pins, the driver reduces time-to-market thanks to a ready-to-go solution

... pre-applied thermal interface material (phase changer). The choice between two different materials optimises either the thermal performance or the allowed heatsink temperature.

Industry standard package with optional:

Available for a complete 17mm high solution

The latest Generation M7 IGBT

More about SEMiX 3 Press-Fit

MiniSKiiP: Scalable without compromise – Power Electronics for Motor Drives

Power Modules

Product Portfolio

 

SEMiX® 3 Press-Fit

Exceeding the standard for superior performance

MiniSKiiP®

Solder-free spring technology for minimum assembly time

SEMIPACK®

Bipolar modules from the market leader

SEMITOP® E1/E2

Exceeding the standard for superior performance

SEMiX® 6 Press-Fit

The complete press-fit standard

SEMITRANS®

The proven power electronics package

SEMITRANS® 10

Robust high power module

SEMITRANS® 20

The new standard in high power

Intelligent Power Modules – IPMs

For Maximum Reliability

 

The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air and water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.

The IPMs of SKiiP 3 platform have propagated widely through the industrial drive segment. With sixpack or half-bridge topologies, it covers a IGBT nominal current range from 500A up to 2400A.

The SKiiP 4 platform products, available in half-bridge topology, cover the highe power range up to 3600A IGBT nominal current. It has been optimized for highest power cycling requirements.

To ensure highest reliability and service life, the SKiiP 4 power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layers between semiconductor chips and DCB, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.

The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.

High performance cooling (HPC) technology has been new introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density. 

Key Features

  • 1200V and 1700V IGBTs
  • Half-bridge and sixpack topology
  • 500A to 3600A IGBT nominal current
  • Flexible cooling options: air, water or customized cooling options, SKiiP 4 high performance water cooling for single and double-sided SKiiP mounting
  • Paralleled operation for even higher output power possible
More about SKiiP

Power Electronic Stack Platforms

Fully Qualified Inverter Assemblies Tailored to Your Specific Needs

Standard Stacks

SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver diode-, thyristor-, IGBT- and SiC-MOSFET-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.

More about Power Electronic Stacks

Customized Stacks

In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized stacks.

Four Key Factors for your success

  • Shortest time to market
  • Cost savings in R&D, production and qualification
  • Global SEMIKRON stack production footprint
  • Highly experienced engineering team
More about Customized Stacks
IGBT Driver

Product Portfolio IGBT Driver

Above the Standard

SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.

SEMIKRON’s IGBT drivers are available as one- or two channel driver boards, two-channel driver cores for PCB-Integration, suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.

Cost Efficient

Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.

Time Efficient

More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.

Reliable

SEMIKRON’s SKYPER and SKHI drivers are well-known, highly robust and reliable IGBT driver solutions, even under demanding environmental conditions.

Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable protection and reinforced insulation.

Key Factors

  • Reinforced insulation for signal and power transmission
  • One- and two-channel driver
  • Up to 1700V transient collector-emmitter voltage
  • Up to 1500V continuous DC link voltage
  • 8Apk to 35Apk output current per channel
  • 1W to 4.2W peak output power per channel
  • Suitable for multi-level topologies and Generation 7 IGBT

Driver Cores

Plug-and-Play Driver

Driver boards, adapter Boards and Application Samples

Thermal Interface Materials (TIM)

Stay Cool – Heat Dissipation is Our Job

 

SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material in thermal paste form. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.

For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.

SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.

Key Features

  • Increased productivity thanks to reduced handling costs and improved logistics
  • Low thermal resistance with optimized TIM layer thickness
  • Improved lifetime and reliability
  • Improved assembly robustness
  • Modules can be shipped directly to the assembly line without any additional treatment processes
  • Lower overall costs

Portfolio

More about Thermal Interface Materials