Power Electronics for
Our solutions for traction
Power Electronics for Traction Applications
Whenever we talk about traction applications, we see extremely high demand for reliability, lifetime and safety. SEMIKRON is offering this requirements to our customers since we developed the first isolated power module on the market in 1974. For 25 years, our highly reliable SKiiP IPMs are driving light rails, trams and subways all over the world.
With our new SEMITRANS 20 power module family, SEMIKRON brings latest sinter and bonding technology to the new high power standard package. SEMIKRON stands also for innovative solutions for auxiliary power supplies: our silicon and silicon carbide powered devices, especially the SEMITRANS and SEMITOP module families, allow reliable, efficient and compact systems.
The New High Power Standard in Traction Drives
The SEMITRANS 20 product family increases product lifetime and power output. SEMITRANS 20 modules deliver significant advantages for the traction market:
On top of this, the SEMITRANS 20 TRACTION module provides SEMIKRON innovative technologies such as sintered chips and AlCu wire bonds. This takes reliability and power density to new levels, resulting in:
- Standard package for traction and industrial applications
- Innovative technologies with sintered chips and AlCu wire bonds
- Next level lifetime and power density
- Lower mounting and material cost in inverter assemblies
- Ideal for paralleling and scaling
SiC and Hybrid SiC modules for auxiliary traction inverters
The SEMITRANS 3 product family is growing with its new full and hybrid SiC half-bridge modules in 1200V and 1700V. This portfolio extension allows highly efficient auxiliary traction inverters. Due to the possibility of high switching frequency for Silicon Carbide devices, the size of the passive components can be reduced, and inaudible to the human ear, allowing reduced acoustic insulation.
The decreased losses reduce service and maintenance costs, thanks to possible natural cooling of the power electronic components.
Multiple sourcing down to chip level ensures maximum supply chain safety.
Benefits of SiC technology in auxiliary traction converters:
MiniSKiiP®Solder-free spring technology for minimum assembly time
SEMITOP® E1/E2Exceeding the standard for superior performance
SEMIPACK®Bipolar modules from the market leader
SEMITRANS® ClassicThe proven power electronics packages
SEMiX® 3 Press-FitExceeding the standard for superior performance
SEMITRANS® 10Robust high power modules
SEMITRANS® 20The new standard in high power
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
The IPMs of SKiiP 3 platform have propagated widely through the industrial drive segment. With sixpack or half-bridge topologies, it covers a IGBT nominal current range from 500A up to 2400A.
The SKiiP 4 platform products, available in half-bridge topology, cover the highe power range up to 3600A IGBT nominal current. It has been optimized for highest power cycling requirements.
To ensure highest reliability and service life, the SKiiP 4 power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layers between semiconductor chips and DCB, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High performance cooling (HPC) technology has been new introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.
- 1200V and 1700V IGBTs
- Half-bridge and sixpack topology
- 500A to 3600A IGBT nominal current
- Flexible cooling options: air, water or customized cooling options
- SKiiP 4 high performance water cooling for single and double-sided SKiiP mounting
- Paralleled operation for even higher output power possible
Product Portfolio IGBT Driver
Above the Standard
SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
SEMIKRON’s IGBT drivers are available as one- or two channel driver boards, two-channel driver cores for PCB-Integration, suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
SEMIKRON’s SKYPER and SKHI drivers are well-known, highly robust and reliable IGBT driver solutions, even under demanding environmental conditions.
Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable protection and reinforced insulation.
- Reinforced insulation for signal and power transmission
- One- and two-channel driver
- Up to 1700V transient collector-emmitter voltage
- Up to 1500V continuous DC link voltage
- 8Apk to 35Apk output current per channel
- 1W to 4.2W peak output power per channel
- Suitable for multi-level topologies and Generation 7 IGBT
Driver boards, adapter Boards and Application Samples
Thermal Interface Materials (TIM)
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material in thermal paste form. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs