Double Sided Sintering Technology

Goodbye, Bond Wires

A Flex Layer Completes the Circuit

Double Sided Sintering (DSS) Technology comprises the application of SiNTER Technology on both front side and back side die attach, combined with a flex layer. In 2011, Semikron Danfoss presented the SKiN module, the first product using DSS Technology with an additional sintered DBC substrate-to-heatsink connection.

The Semikron Danfoss SiNTER Technology utilizes a fine silver powder at a temperature of around 250°C under high pressure, sintered into a layer of very low porosity. It connects chip, DBC substrate surface, and flex layer in an extremely long-life, reliable material stack, benefitting from the melting point of silver at 962°C.

The flex layer takes over the function of the bond wires and connects the chip via a much bigger area connection. It allows for an increase of the surge current capability by about 25%. Compared to conventional power modules the additional performance allows an approximate doubling of the current density on system level.

Double Sided Sintering: Key Features

  • Highly reliable sinter connections replace solder and wire bonds
  • High power density
  • High power cycling reliability
  • 25% higher surge currents thanks to a large front side contact area