IGBT module with integrated driver and heat sink for converter powers of up to 2.1 Megawatt / Use of sinter technology for maximum reliability / Areas of application include wind and solar power systems, and railway applications / Lower service costs
SEMIKRON, global leader in the field power electronics, launches series production of its SKiiP 4 line. On the power density front, SKiiP 4 modules outdo all other IGBT modules on the market and feature integrated driver and heat sink into the bargain.
The power components in SKiiP 4 modules can be operated at a junction temperature of up to 175°C. To make sure that these high temperatures can be used reliably, the power components are 100% solder-free. SKiiP4 modules do away with the conventional base plate, reducing mechanical stresses. The use of Skinter sinter technology also means that the solder layer, which can be detrimental to component or module life, is replaced by a sintered silver layer, achieving five times the reliability when subjected to passive thermal cycling. The power cycle is 2 to 3 times greater than that of soldered base-plate modules. In practice this means greater reliability in the field, as well as lower service costs.
The integrated gate driver in the SKiiP 4 sets new standards on the reliability and functionality fronts. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and all measurement parameters, such as temperature and DC link voltage. This means users no longer have to introduce complex and costly circuit components to provide safe isolation. The SKiiP driver features a CANopen setup and diagnosis channel – a first in a power module – which enables access to an error memory, meaning errors in the SKiiP 4 can be quickly identified and saved for later diagnosis.
Today, many decentralised green power supply systems are monitored for errors remotely. The CANopen interface facilitates the integration of diagnosis functions into the remote control and monitoring concept. Even without direct integration of the CAN interface into the controller, this feature is still very useful as regards on-site service and maintenance tasks.
Besides error diagnosis, settings in the SKiiP 4 driver can also be adjusted. For example, the switching threshold can be adapted to the given application for DC link voltage monitoring purposes.
SEMIKRON is a leading global power semiconductor manufacturer. The German-based family enterprise employs 3900 people worldwide. A global network of 36 companies with production plants in Brazil, China, France, Germany, India, Italy, Korea, Slovakia, South Africa and USA guarantees fast and competent on-site customer care. SEMIKRON is a one-stop provider of chips, discrete semiconductors, transistor, diode and thyristor power modules, power assemblies and systems for markets such as industrial drives, wind and solar, hybrid and electric vehicles, the rail industry and power supply systems. SEMIKRON is the market leader in the field of diode/thyristor semiconductor modules, enjoying a 30% share of the worldwide market. (Source: IMS Research, The World Market for Power Semiconductor Discretes & Modules – 2011 Edition).
Our dedication to the hybrid and electric vehicle market is evident in the development and production of power semiconductors for this market, as well as in the majority take-over of Compact Dynamics GmbH, a development specialist for innovative control systems, the joint venture with drivetek, a provider for application-specific control technology, and the take-over of VePOINT, developing and producing inverters, DC/DC converters and chargers. Recently, SEMIKRON introduced a revolutionary packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN Technology is based on the use of a flexible foil and sintered connections rather than bond wires, solders and thermal paste. This results in a higher current carrying capacity and 10 times the load cycle capability – unthinkable with the restrictive wire bonding used in power electronics in the past. This enables a reduction in converter volume by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.