Power Electronics for
Energy Storage Systems
Our solutions for energy storage systems
Customer service
Product service
Power Electronics for Energy Storage Systems
With decentralized renewable energy sources in our power grid, the demand for energy storage systems to stabilize fluctuations is quickly growing. SEMIKRON’s portfolio includes a wide range of products for energy storage systems, from small and medium power modules for residential and industry scale storage systems to high power components for utility-grade storage systems.
SEMIKRON products deliver maximum reliability, meeting the extended lifetime requirements of energy storage systems. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to- use power electronic stacks – SEMIKRON has the solution.
Performance Range
- LOW/MEDIUM POWER10kW - 75kWResidential scale, Commercial/Industrial scale, Solar + Storage
- Compact designs and high power density
- High efficiency
- High reliability to reduce downtime
- MEDIUM/HIGH POWER50kW - 5MWCommercial/Industrial scale, Utility scale, Solar + Storage
- 1500VDC Capability
- High efficiency
- High reliability to reduce downtime
Product Highlights
The Latest Generation 7 IGBT for Highest Supply Chain Safety
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
For ANPC topologies, SEMIKRON’s new SEMITRANS 20 power module combines low stray inductance, high power density and Generation 7 IGBTs to set a new benchmark. This package design, based on standard half-bridge topology, allows a simple ANPC layout with low inductance DC-link connections.
Reduced system cost thanks to 3-level-topology
- Reduced magnetics cost thanks to 3-level topology
- Up to 1.5MW without paralleling
- Reduce switching losses with 1200V IGBT
- Latest Generation 7 IGBTs
- Reduced cable diameters or cable losses
- Reduced cooling requirements
Comprehensive Sixpack and 3-Level Module Family
With its comprehensive portfolio and its optimised design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. Adapter boards for easy gate drive integration are also available.
The internal chip layout is optimised for enhanced thermal performance, reducing operating temperatures, thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
Key Features
- Low stray inductance package
- Solder-free assembly
- Optimized thermal performance
- Flexible architecture
- Press-fit design
- 17mm module height
Exceeding the standard
- Optimized module design for ultimate thermal footprint
- Effective heat spread for improved thermal performance
- Longer lifetime for tighter reliability requirements
- Suitable for very fast switching applications thanks to very low inductance layouts
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard stacks
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.
- Water-cooled IGBT Stacks
SKiiPRACK
SEMIKUBE MLI - Air-cooled IGBT Stacks
SEMIKUBE
SEMIKUBE SlimLine - Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C
Customised stacks
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 15 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silk screen and stencil printing line.
For each requirement SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change mate- rials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate- less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
Key Features
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimised TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs
Portfolio
- P8: Phase Change Material for highest performance
- HT: Phase Change Material for highest sink temperature
- HPTP: High Performance Thermal Paste
- P12: Standard Thermal Paste
