Power Electronics for
UPS Systems

Our solutions for your UPS system

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Power Electronics for UPS Systems

The availability of infrastructure systems strongly depends on reliable power supplies, irrespective of whether these systems are servers and cloud storage systems, critical traffic control or hospital services.

Uninterruptable power supplies (UPS) ensure continuous operation of these critical systems. In SEMIKRON power modules, flexible topologies equipped with the latest IGBT and diode chips ensure maximum conversion efficiency for double conversion UPS systems. This efficiency can be further improved using Silicon Carbide technology.

Performance Range

Product Highlights

Compact and Efficient 100kVA Systems

UPS solutions for data centres today are based on modular UPS systems. In these systems several independent UPS modules in 19’’ frames are paralleled with single modules up to 100kVA. This achieves high scalability and easy implementation of redundancy.

The MiniSKiiP UPS power modules are available as symmetrical boost for the input stage and 3-level NPC topology for the output side. Both are based on fast swiching 650V IGBTs to allow high switching frequency and high efficiency at the same time, up to 100kVA output power. Optional Silicon Carbide components can increase efficiency even further.

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Most Comprehensive UPS Portfolio
Highest UPS Power Density with SEMiX 5

With its comprehensive portfolio and its optimised design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. An adapter board for easy gate drive integration is also available.

The internal chip layout is optimised for enhanced thermal performance, reducing operating temperatures and thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.

High power density thanks to comprehensive portfolio

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MiniSKiiP: Scalable without compromise – Power Electronics for UPS Systems

Power Modules

Product Portfolio


SEMiX® 5

Extended standard for superior thermal and dynamic performance



Solder-free spring technology for minimum assembly time



Bipolar modules from the market leader



Exceeding the standard for superior performance


SEMiX® 3 Press-Fit

Exceeding the standard for superior performance



The proven power electronics package



Robust high power module



The new standard in high power


Intelligent Power Modules – IPMs

The Most Powerful IPM in the Market


The SKiiP IPMs set a benchmark for high performance and robust Inverter designes. Especially the SKiiP 4 with its sintered chips is an enabler for maximum load cycle capability and lifetime for use in traction applications. With its solder-free power circuit and the ASIC based driver, the SKiiP 4 IPM stands for high reliability as no other high power IPM.

The power semiconductors used in SKiiP 4 modules can be operated up to a junction temperature of 175°C. To make sure these components can be reliably used at these temperatures, the power circuitry is 100% solder-free. Sinter technology is used to create a sintered silver layer instead of the solder layer which could limit the service life of power modules. Reliability during active and passive thermal cycling is greatly improved.

The integrated gate driver in the SKiiP 4 sets new standards in terms of reliability and functionality. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. This means the user no longer has to introduce complex and costly topology components to provide safe isolation.

Key Features

  • 1200V and 1700V
  • Half-bridges and sixpacks
  • 1800A to 3600A
  • Flexible cooling options: air, water or customized cooling options
  • Paralleled operation for even higher output power possible
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Power Electronic Stack Platforms

Fully Qualified Inverter Assemblies Tailored to Your Specific Needs

Standard stacks

SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.

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Customised stacks

In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions.Engineers are available in our stack centres around the globe to offer specific solutions by adapting existing platforms or designing customized converters.

Four Key Factors for your success

  • Shortest time to market
  • Cost savings in R&D, production and qualification
  • Global SEMIKRON stack production footprint
  • Highly experienced engineering team
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Product Portfolio IGBT Driver

Above the Standard

SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.

SEMIKRON’s IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.


Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.


More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.


SEMIKRON’s SKYPER and SKHI IGBT drivers are well known, highly robust and reliable IGBT driver solutions under demanding environmental conditions.

Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.

Key Factors

  • Reinforced insulation for signal and power transmission
  • Two-channel driver
  • Up to 1700V transients
  • Up to 1500V continuous DC bus voltage
  • 8Apk to 35Apk per channel
  • 1W to 4.2W peak per channel
  • Suitable for multi-level topologies and Generation 7 IGBT







Thermal Interface Materials

Stay Cool – Heat Dissipation is Our Job


SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.

For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.

SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.

Key Features

  • Increased productivity thanks to reduced handling costs and improved logistics
  • Low thermal resistance with optimized TIM layer thickness
  • Improved lifetime and reliability
  • Improved assembly robustness
  • Modules can be shipped directly to the assembly line without any additional treatment processes
  • Lower overall costs


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