TP(HPTP)Mini1II.Gen

Thermal Interface Materials
MiniSKiiP II 1

Part Number 12281110
TiM
material
High Performance Thermal Paste
Weight in mg 170
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production

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SEMIKRON MiniSKiiP II 1
SEMIKRON inhomog. honeycomb structure

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TP(HPTP)Mini1II.Gen Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

TP(HPTP)Mini1II.Gen Target Applications

Additional Searches

TP(HPTP)Mini1 II.Gen, TP(HPTP)Mini 1II.Gen, TPHPTPMini 1IIGen, TPHPTPMini1IIGen, TPHPTPMini1 IIGen