TP(P12)Mini8AC

Thermal Interface Materials
MiniSKiiP 8

Part Number 12281320
TiM
material
Wacker P12
Weight in mg -
Thickness (after assembly) in µm 60
Tolerances (+/-) in µm 10
Product Status In production

Back to product overview
SEMIKRON MiniSKiiP 8
SEMIKRON honeycomb structure

Downloads

Customer Support

Contact Customer Support

TP(P12)Mini8AC Features

• Honeycomb structure

• Optimized thickness of thermal paste

layer

• Enhanced heat dissipation

• High process reliability due to

automated screen printing process

TP(P12)Mini8AC Target Applications

Additional Searches

TP(P12)Mini8 AC, TP(P 12)Mini8AC, TP(P 12 )Mini 8AC, TP(P 12)Mini8 AC, TP(P 12 )Mini8AC, TPP 12Mini8AC, TPP 12Mini8 AC, TPP12Mini 8 AC, TPP12Mini8 AC, TPP 12 Mini8AC