SEMITOP® 1-4

Flexible architecture and high-performance chip technologies in a compact design

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SEMITOP® 1-4 – Up to 60kW

The SEMITOP family is a 12-mm-height module family for the low and medium-power range, featuring a single mounting screw, without baseplate, and PCB interface via solder or press-fit pins. Low commutation inductance design and the use of the latest Si and SiC chip technologies make this product suitable for UPS, solar, energy storage, motor drives, power supplies and welding equipment.

SEMITOP® 1-4 Benefits

SEMITOP features a single mounting screw for quick and easy assembly to the heatsink. The central screw enables optimum pressure distribution for increased reliability and optimized assembly process. Two PCB contact technologies are available: solder or press-fit terminals. Extremely flexible architecture combined with a low-inductance design make SEMITOP the ideal platform for customized solutions, including the latest Si and SiC chip technologies. Paralleling different devices on the same PCB is possible thanks to the 12mm height compatibility, thus reducing the development time for the whole assembly and shortening time-to-market.

SEMITOP® 1-4 Key Features

  • One central mounting screw for low mounting costs and reliable assembly
  • Baseplate-less design
  • Low thermal resistance thanks to homogeneous pressure distribution
  • Press-fit pins or solder terminals as PCB interface
  • High integration level for compact design
  • Low-inductance design
  • Paralleling on the same PCB possible thanks to height compatibility
  • Wide range of Si and SiC chip technologies
  • Flexible architecture for customized designs

SEMITOP® 1-4 Applications

SEMITOP with press-fit or solder pins is a useful product for the low and medium-power range, where flexibility and a high integration level are required. State-of-the-art chip technologies and the ability to offer compact designs make this product suitable for a variety of configurations, including new high-performance configurations such as 3-level inverters (NPC and TNPC), double boost and interleaved boost applications, covering different markets such as UPS systems, solar, ESS,  motor drives and welding equipment.

SEMITOP® 1-4 Product Range

The SEMITOP portfolio includes fast Si diodes, fast 650V/1200V IGBTs and MOSFETs for high voltage. The latest SiC chip technologies for diodes and MOSFETs can be integrated in the platform, making many different configurations with different chip combinations possible:

  • Diode and thyristor based modules
  • Single and 3-phase bridge rectifier
  • Neutral point clamp 3-level configuration (NPC)
  • T-type NPC 3-level configuration (TNPC)
  • 3-phase inverter (Sixpack)
  • CIB configurations (converter-inverter-brake)
  • Full and Hybrid SiC configurations
  • Customized configurations possible

SEMITOP® IGBT Modules

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SEMITOP® Full SiC Modules

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SEMITOP® MOSFET Modules

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SEMITOP® Bridge Rectifier Modules

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SEMITOP® Thyristor/Diode Modules

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Flexible Architecture and High-Performance Chip Technologies in a Compact Design

Flexible and compact design for a broad product portfolio

  • Four different housing sizes for a wide power range
  • Available with solder terminals or press-fit pins
  • Flexible layout routing to fit the most complex of configurations

High-performance product featuring the latest SiC chip technologies

  • Full SiC solution: SiC MOSFET, with or without SiC Schottky free-wheeling diode
  • Hybrid solution: Si IGBT with SiC Schottky free-wheeling diode
  • Low-inductance design approach for high module performance
  • Customer-specific solutions

Quick and easy single-screw assembly

  • Only one mounting screw instead of two clips to reduce assembly time and save on material resources
  • Homogeneous pressure distribution for lower thermal performance compared to lateral mounting screws
  • No retightening of the screw required
  • Single threaded hole in heatsink, resulting in low heatsink costs