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SEMITOP® 1-4 – Up to 60kW

The SEMITOP family is a 12-mm-height module family for the low and medium-power range, featuring a single mounting screw, without baseplate, and PCB interface via solder or press-fit pins. Low commutation inductance design and the use of the latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies and welding equipment.

SEMITOP® 1-4 Benefits

SEMITOP features a single mounting screw for quick and easy assembly to the heatsink, far faster than with two lateral mounting screws. The central screw allows for optimum pressure distribution for the thermal paste, thus ensuring minimum thermal resistance values for longer power cycling capability and reliability over time. Today, this product is available with two optional PCB interface connections: solder terminals or press-fit technology. This enables customers to optimise their production process and achieve a fast time-to-market. Pressfit technology is the alternative solution to solder mounting and switching over from soldered to solder-free assembly to the PCB is facilitated thanks to the 100% pinout compatibility. Pins on the edges make PCB routing simple, allowing for more internal space that can be used to fit the most complex of topologies inside a very compact space. This extremely flexible architecture with a low-inductance design, coupled with the latest Si and SiC chip technologies, make SEMITOP a suitable platform even for customer-specific solutions where new challenging requirements are expected to be fulfilled. Multiple paralleling on the same PCB is possible thanks to the 12mm height compatibility, thus reducing the development time for the whole assembly and shortening time-to-market.

SEMITOP® 1-4 Key Features

  • One central mounting screw for low mounting costs and reliable assembly
  • No baseplate design
  • Insulated module
  • Low thermal resistance thanks to homogeneous pressure distribution
  • Press-fit pins or solder terminals as PCB interface
  • High integration level for compact design
  • Low-inductance design approach
  • Multiple paralleling on the same PCB possible thanks to height compatibility
  • Wide range of SI and SiC chip technologies
  • Flexible architecture for customer-specific designs

SEMITOP® 1-4 Applications

SEMITOP with press-fit or solder pins is a useful product for the low and medium-power range, where flexibility and a high integration level are required. State-of-the-art chip technologies and the ability to offer compact designs make this product suitable for a variety of configurations, including new high-performance configurations such as 3-level inverters (NPC and TNPC), double boost and interleaved boost applications, covering different markets such as UPS systems, solar, motor drives and welding equipment.

SEMITOP® 1-4 Product Range

SEMITOP modules can include fast-Si diodes, fast IGBTs 650V/1200V versions and MOSFETs even for high voltage. Even the latest SiC chip technologies for diodes and MOSFETs can be considered for use in this platform, meaning a lot of different configurations with different chip combinations are possible:

  • 3-phase inverter up to 200A/600V and 100A/1200V
  • CIB configurations up to 100A/600V and 50A/1200V
  • Single leg of three-level inverter (NPC) up to 150A/650V as well as up to 75A/1200V for a max. DC-link of 1500V
  • T-type three-level inverter (TNPC) up to 150A/1200V (half-bridge) and 100A/650V (neutral point leg)
  • MOSFET configuration up to 300A
  • 3-phase bridge rectifier up to 100A DC output current
  • Plus many other configurations

SEMITOP® IGBT Modules

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SEMITOP® Full SiC Modules

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SEMITOP® MOSFET Modules

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SEMITOP® Bridge Rectifier Modules

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SEMITOP® Thyristor/Diode Modules

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Flexible Architecture and High-Performance Chip Technologies in a Compact Design

Flexible and compact design for a broad product portfolio

  • 4 different housing sizes for a wide power range: SEMITOP4, SEMITOP3, SEMITOP2, SEMITOP1
  • Available with solder terminals or press-fit pins
  • Flexible layout routing to fit the most complex of configurations

High-performance product featuring the latest SiC chip technologies

  • Full SiC solution: SiC MOSFET, with or without SiC Schottky free-wheeling diode
  • Hybrid solution: Si IGBT with SiC Schottky free-wheeling diode
  • Low-inductance design approach for high module performance
  • Customer-specific solutions
  • Samples available on request

Quick and easy single-screw assembly

  • Only one mounting screw instead of two clips to reduce assembly time and save on material resources
  • Homogeneous pressure distribution for lower thermal performance compared to lateral mounting screws
  • No retightening of the screw after some time
  • Only one threaded hole in the heatsink compared to side mounting system, resulting in lower heatsink costs