SEMITOP® E1/E2

Exceeding the Standard

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SEMITOP® E1/E2 – Up to 200kW

The SEMITOP E1/E2 design offers an alternative to the established industrial standard packages, down to the chip level, for supply chain safety. Superior thermal performance combined with a low-inductance design make SEMITOP E1/E2 the perfect package for the latest  Si and SiC chips technologies.

SEMITOP® E1/E2 Benefits

SEMITOP E1/E2 represent the SEMITOP platform’s natural evolution to an enhanced package, offering the best footprint, an extremely flexible architecture and high performing solutions at optimized system cost.

Integrated with the latest Si and SiC chip technologies, SEMITOP E1/E2 offers a competitive platform. Thus able to address the power modules demanding environment where high performance, innovation, quality standards and cost are the key winning factors.

Developed as an extension of SEMITOP 1-4 line up, the SEMITOP E pushes flexibility and power density to the limit, enabling platform to cover applications up to 200kW. SEMITOP E is available in two different housing sizes, E1 and E2, offering a package compatible with the industrial standard.

SEMITOP® E1/E2 Key Features

  • 12 mm height
  • Baseplate-less
  • Press-fit and Solder terminals
  • Two screw mounting for design simplicity
  • Optimized design for superior thermal performance
  • Extreme flexibility pin layout
  • Low inductance design
  • Available with pre-applied TIM

SEMITOP® E1/E2 Applications

The SEMITOP E1/E2 family is designed for the low and medium power range of up to 200kW. High performance and low inductance design, combined with the latest chip technologies, make SEMITOP E1/E2 suitable for different markets such as UPS, solar, energy storage, motor drives, power supplies and the emerging EV battery charger market.

SEMITOP® E1/E2 Product Range

The SEMITOP E1/E2 portfolio integrates Si and SIC diodes, fast 650V/1200V IGBTs, and both Si and SiC MOSFETs. A large variety of configurations is possible with SEMITOPT E1/E2, from standard topologies to customized solutions:

  • 3-level Neutral Point Clamp (NPC), single phase and 3-phase
  • 3-level Active Neutral point clamp (ANPC)
  • 3-level T-type NPC (TNPC), single phase and 3-phase
  • 3-level Split-NPC/ANPC
  • Boost chopper
  • 3-phase inverter (Sixpack)
  • CIB (converter-inverter-brake)
  • Bridge rectifier
  • Full and Hybrid SiC configurations
  • Customized configurations

SEMITOP® IGBT Modules

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SEMITOP® Full SiC Modules

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SEMITOP® MOSFET Modules

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SEMITOP® Bridge Rectifier Modules

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Industrial Standard Package at Superior Performance

Broad product portfolio

Portfolio topology vs. current rating
  • Comprehensive portfolio for 2-level and 3-level applications
  • Wide range of applications (UPS, ESS, Solar, Drives, EV-charging)
  • Multiple chip sourcing

State-of-the-art products

State-of-the-art products
  • Latest Si and SiC technology
  • Low-inductance design (down to 4nH)
  • Extreme Flexibility for complex configurations
  • Integration of SMD components (NTC, Shunt, Capacitors, Gate resistors)
  • Customized designs

Superior thermal performance

Thermal resistance Rth(j-s) [K/W] comparison
  • Optimized design for very low thermal  resistance
  • Lower Tj for higher efficiency and longer lifetime