SEMiX® 3 Press-Fit
For solder-free mounting with press-fit contacts
SEMiX® 3 Press-Fit Benefits
The concept of SEMiX 3 Press-Fit is a 17mm height module. Press-fit contacts allow for a gate driver mounted directly on top of the module. Therefore, there is no risk of noise on wires or loose connectors. Compact, state-of-the-art inverter construction is possible thanks to the slim package and separated AC and DC terminals.
Auxiliary contacts avoid solder joints, instead using highly reliable press-fit contacts. This leads to increased product reliability and lifetime. Press-fit contacts allow fast and easy production, optimized through uniform direction of assembly, reducing manufacturing costs.
The SEMiX 3 Press-Fit modules have optional built-in shunt resistor for measuring the AC current, accessible via press-fit pins. This allows the footprint and main connections to remain identical to the standard module, while eliminating the need for current sensors. Integrating the current monitoring into the power module reduces inverter volume and decreases system costs. Additionally, reducing components in the inverter enhances the FIT rate.
SEMiX® 3 Press-Fit Key Features
- Integrated current-sensing shunt resistor
- Half-bridge topologies from 300A to 600A at 1200V and 1700V
- Direct driver assembly
- Versatile connection concept
- Solder-free contacts for highest durability
SEMiX® 3 Press-Fit Applications
SEMiX 3 Press-Fit is a flexible and application oriented module. These IGBT modules have the latest chip technology optimized for AC motor drives, switching power supplies and current source inverters. Other typical applications include uninterruptible power supplies, photovoltaic systems and wind energy.
SEMiX® 3 Press-Fit Product Range
Half-bridge modules in 1200V and 1700V are available in the SEMiX 3 Press-Fit package with optional shunt resistors.