SEMiX® 3 Press-Fit Benefits
The concept of SEMiX 3 Press-Fit is a 17mm height module. Press-fit contacts allow for a gate driver mounted directly on top of the module. So there is no risk of noise on wires or loose connectors. With the flat package and separated AC and DC terminals a state-of-the-art inverter construction is possible, which is very compact. The auxiliary contacts avoid solder joints and offer highly reliable press-fit contacts. This leads to increased product reliability and life-time. The solder-free contacts allow a fast and easy assembly. Production at the customer site can be optimised by uniform direction of assembly. This simplifies logistics and reduces manufacturing costs. The SEMiX 3 Press-Fit package is also available with a shunt resistor for current monitoring in the AC path. Footprint and main connections are identical to the standard module and the shunt is also equipped with Press-Fit contacts, like the other auxiliary connections. Including the current monitoring into the IGBT module reduces the inverter volume and decreases the system costs, as less material is in use. At the same time the FIT rate is enhanced, by reducing the number of necessary components in the inverter.
SEMiX® 3 Press-Fit Key Features
- Integrated current-sensing shunt resistor
- Half-bridge topologies from 300A to 600A at 1200V and 1700V
- Direct driver assembly
- Versatile connection concept
- Solder-free contacts for highest durability
SEMiX® 3 Press-Fit Applications
SEMiX 3 Press-Fit is a flexible and application oriented module. Modern chip technology is integrated into IGBT modules which are used in a wide variety of applications, such as AC motor drives, switching power supplies and current source inverters. Other typical applications include uninterruptible power supplies, photovoltaic systems and the field of wind energy.
SEMiX® 3 Press-Fit Product Range
Half-bridge modules in 1200V and 1700V are available in the SEMiX 3 Press-Fit package with and without an adjusted shunt resistor.