SEMiX® 6

The complete press-fit standard

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The Industry Standard for Reliable Connection Technology

SEMiX 6 features state-of-the-art press-fit pin technology for both power and auxiliary terminals. With solder-free mounting technology, the 17-mm-high SEMiX 6 maximizes production efficiency. With the SEMiX 6, connect all terminals in a single production step.

SEMiX® 6 Benefits

The SEMiX 6 platform offers a scalable, flexible solution for high-performance inverter architectures. The press-fit design ensures full compatibility to the market standard, yet optimized for gentle and reliable PCB assembly.

Reduce inverter assembly cost and reach 100% process control using press-fit technology for all the terminals, for auxiliary and power connection. Junction temperatures up to 175°C allows far superior performance than comparable solutions on the market. This improved performance combined with our design for minimum power losses is ideal for achieving compact inverter systems on a single PCB basis. 

SEMiX® 6 Key Features

  • Fully compatible with industry standard
  • Solder-free assembly
  • 17 mm in height
  • Press-fit technology for auxiliary and power terminals
  • Baseplate solution
  • Flexible platform for custom designs

SEMiX® 6 Applications

This tested package features a robust baseplate solution combined with a full press-fit concept for all electric terminals, creating a competitive platform for PCB-based inverter solutions. The package is suitable for a broad range of applications, including:

  • AC inverter drives
  • UPS systems
  • Renewable energy systems

SEMiX® 6 Product Range

SEMiX 6 features 7th generation IGBTs for lower costs thanks to higher current density. The rectifier portfolio introduces our new SKR PEP up to 2200V and 160kW. This is the perfect match for the IGBT sixpacks in the same package, equipped with the latest IGBT chip technology in 650V, 1200V and 1700V. The CIBs round off the portfolio in 650V, 1200V and 1700V.

The Industry Standard for Reliable Connection Technology

Press-fit technology for reliable, solder-free mounting

  • Fast mechanical connection in cold welding process
  • Direct elastic connection with defined parameters and high electrical conductivity
  • Thermal material expansion is absorbed elastically by each individual connection
  • All the contacts to the PCB connected in just 0.1s
  • Reliable and controlled press-fit connection

For compact designs and optimized process costs

  • Efficient, easy to automate production process
  • Low inductance connection with DC link capacitors
  • Simpler logistics and fewer parts
  • Simple ISO coordination
  • Compact system design

SEMiX® 6 Product Portfolio

SEMiX 6: 122.0mm x 62.0mm x 17.0mm (L x W x H)

Rectifier
Type DesignationTopologyVRRM in [V]ID in [A]
SEMiX636D16pB6U1600700
SEMiX586D16pB6U1600700
SEMiX526D22pB6U2200650
SEMiX126DGL22pB6U + Chopper2200400
SEMiX186DGL16pB6U + Chopper1600400


IGBT Modules
Type DesignationTopologyVCES in [V]ICnom in [A]
SEMiX106GD12T4pSixpack1200100
SEMiX156GD12T4pSixpack1200

150

SEMiX206GD12T4pSixpack1200200
SEMiX106GD12M7pSixpack1200100
SEMiX156GD12M7pSixpack1200150
SEMiX206GD12M7pSixpack1200200
SEMiX256GD12M7p Sixpack1200250
SEMiX076DGDL12M7pCIB120075
SEMiX106DGDL12M7pCIB1200100
SEMiX156DGDL12M7pCIB1200150
SEMiX206DGDL12M7pCIB1200200

SEMiX® 6 IGBT Modules

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SEMiX® 6 Full SiC Modules

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SEMiX® 6 Hybrid-SiC Modules

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SEMiX® 6 MOSFET Modules

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