IGBT and rectifier module family for solder-free mounting
SEMiX® Spring Benefits
The family concept of SEMiX includes a unification of IGBT and rectifier housings. All have the same height (17mm) and can be connected by one principal DC-link design, due to having the same interface for IGBT and rectifier stage. This saves development time and makes a simple and low-inductance DC-link profile possible. Spring or press-fit contacts allow for a gate driver mounted directly on top of the module. So there is no risk of noise on wires or loose connectors. With the flat package and separated AC and DC terminals a state-of-the-art inverter construction is possible, which is very compact. The auxiliary contacts avoid solder joints and offer highly reliable pressure contacts. This leads to an increased product reliability and lifetime. The solder-free contacts allow fast and easy assembly process and especially spring contacts are user friendly with regard to servicing. Production at the customer site can be optimised by uniform direction of assembly (everything top down). This simplifies logistics and reduces manufacturing costs. Using the scalability of SEMiX Spring housings, with one basic design a complete inverter line can be built with less effort. In consequence the overall costs can be reduced.
SEMiX® Spring Key Features
- Available in 600V, 1200V and 1700V and from 75A to 600A
- Multiple IGBT sources
- Solder-free contacts for highest durability
- Family concept with IGBT modules and bridge rectifiers
- Comprehensive topologies for 2- and 3-level applications
SEMiX® Spring Applications
SEMiX Spring is a flexible and application-oriented module. On the basis of a scalable platform concept, modern chip technology is integrated into IGBT and rectifier modules which are used in a wide variety of applications, such as AC motor drives, switching power supplies and current source inverters. Other typical applications include uninterruptible power supplies, photo voltaic systems and the field of wind energy.
SEMiX® Spring Product Range
Six different housing sizes are available in 600V, 1200V and 1700V for the IGBT modules. Half-bridge, 6-pack and chopper topologies are available with a current range from 75A to 600A. Besides IGBT3 and IGBT4 chips, the 1200V range also includes a series with V-IGBT devices. Controlled, half-controlled and uncontrolled rectifier modules with identical footprint and 17mm height are also available.