SKiM® 63/93

Improved reliability and performance thanks to advanced technology

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SKiM® 63/93 – 22kW up to 180kW

In e-mobility applications, reliability is the most important feature.

Thanks to new thermal interface material with 20% thermal improvement and AlCu-bonded diodes with higher current carrying capacity, the new SKiM module can bring about an improvement of up to 23% with the same chip set and same lifetime or twice the power cycling capability in comparison to standard sinter modules!

SKiM® 63/93 Benefits

SKiM 63/93 modules increase inverter reliability, even under substantial active and passive temperature swings. Sintered chips, pressure contacts, spring technologies, AlCu-bonded diodes and high performance thermal grease allow the SKiM 63/93 to deliver up to 23% better performance for transient currents with the same chip set and the same lifetime as standard sinter modules.

SKiM® 63/93 Key Features

  • IGBT power module in sixpack configuration
  • Three separate half-bridges
  • Available in 600V, 1200V and 1700V and from 200A to 900A
  • 1200V/600A also available in buck/boost configuration
  • Solder-free design for extended service life
  • Baseplate-less design
  • Solder-free module and driver PCB mounting
  • Low inductance design thanks to symmetrical layout

SKiM® 63/93 Applications

The SKiM 63/93 is designed for applications that require a high level of inverter reliability, in particular automotive applications such as electric powertrains in electric utility vehicles, heavy-duty construction machinery and tractors. These modules are also used to deliver leading-edge performance in supersports and race cars.

SKiM® 63/93 Product Range

The SKiM 63/93 offers sixpack topologies at 600V, 1200V and 1700V. The power ranges from 20kW to 180kW from 300A to 900A. Modules in buck and boost configuration for 1200V/600A round off the portfolio. Driver solutions are also available as is an optimised water cooler for fast and customer friendly evaluation. In addition, paralleling boards for a simple and powerful half-bridge configuration are also available.

SKiM 63/93

SKiM® IGBT Modules

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SKiM® Hybrid SiC Modules

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Advanced Characteristics for Higher Transient Currents

+23% improvement with same chip-set/lifetime

SKiM®63/93 AlCu-bonded diodes: ΔT=70°C, cycle temperature 80°C...150°C
  • Twice the power cycling capability of standard sinter modules
  • 20% improvement in thermal resistance thanks to new thermal interface material
  • AlCu-bonded diodes with higher current carrying capacity

Temperature cycling capability: 15 x higher

ΔT = 165 °C cycle temperature -40 °C … +125 °C, cycle time 90 min

Enhanced torque and reliability performances with same chip set/module size

Al clad Cu bond wires
  • Advanced diode bond: Al clad Cu bond wires
  • Bonding with: standard bonding equipment, standard chip surface
Thermal paste for modules without baseplates
  • TIM: Pre-applied High Performance Thermal Paste

100% solder-free

Solder-free design for highest durability
  • Auxiliary contacts: Pressure contacted to DBC and PCB
  • Power terminals: Pressure contacts for connection to DBC
  • Chip: Sintered to DBC , Al or AlCu wire bonded diodes
  • No baseplate: Directly pressed to heat sink. Excellent thermal flow with only 25μm thermal paste thickness