TP(HPTP)Mini0

Thermal Interface Materials
MiniSKiiP II 0

Part Number 12281145
TiM
material
High Performance Thermal Paste
Weight in mg 145
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production new

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SEMIKRON MiniSKiiP II 0
SEMIKRON honeycomb structure

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TP(HPTP)Mini0 Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

TP(HPTP)Mini0 Target Applications

Additional Searches

TPHPTPMini0