TP(HPTP)Mini8AC

Thermal Interface Materials
MiniSKiiP 8

Part Number 12281140
TiM
material
High Performance Thermal Paste
Weight in mg 820
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production

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SEMIKRON MiniSKiiP 8
SEMIKRON inhomog. honeycomb structure

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TP(HPTP)Mini8AC Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

TP(HPTP)Mini8AC Target Applications

Additional Searches

TP(HPTP)Mini8 AC, TP(HPTP)Mini 8AC, TPHPTPMini 8AC, TPHPTPMini8 AC, TPHPTPMini8AC