TP(HTC)Mini3II.Gen

Thermal Interface Materials
MiniSKiiP II 3

Part Number 12280950
TiM
material
Electrolube HTC
Weight in mg -
Thickness (after assembly) in µm 60
Tolerances (+/-) in µm 10
Product Status In production

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SEMIKRON MiniSKiiP II 3
SEMIKRON honeycomb structure

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TP(HTC)Mini3II.Gen Features

• Honeycomb structure

• Optimized thickness of thermal paste

layer

• Enhanced heat dissipation

• High process reliability due to

automated screen printing process

TP(HTC)Mini3II.Gen Target Applications

Additional Searches

TP(HTC)Mini3 II.Gen, TP(HTC)Mini 3II.Gen, TPHTCMini3IIGen, TPHTCMini 3IIGen, TPHTCMini3 IIGen