TP(P12)Mini0

Thermal Interface Materials
MiniSKiiP II 0

Part Number 12281800
TiM
material
Wacker P12
Weight in mg -
Thickness (after assembly) in µm 33
Tolerances (+/-) in µm 10
Product Status In production

Back to product overview
SEMIKRON MiniSKiiP II 0
SEMIKRON honeycomb structure

Downloads

Customer Support

Contact Customer Support

TP(P12)Mini0 Features

• Honeycomb structure

• Optimized thickness of thermal paste

layer

• Enhanced heat dissipation

• High process reliability due to

automated screen printing process

TP(P12)Mini0 Target Applications

Additional Searches

TP(P 12 )Mini0, TP(P 12)Mini 0, TP(P12)Mini 0, TP(P 12)Mini0, TP(P12 )Mini 0, TPP 12Mini 0, TPP 12Mini0, TPP12Mini 0, TPP12 Mini 0, TPP 12 Mini0