TP(P12)Mini3I.Gen

Thermal Interface Materials
MiniSKiiP 3

Part Number 12280880
TiM
material
Wacker P12
Weight in mg -
Thickness (after assembly) in µm 45
Tolerances (+/-) in µm 10
Product Status In production

Back to product overview
SEMIKRON MiniSKiiP 3
SEMIKRON honeycomb structure

Downloads

Customer Support

Contact Customer Support

TP(P12)Mini3I.Gen Features

• Honeycomb structure

• Optimized thickness of thermal paste

layer

• Enhanced heat dissipation

• High process reliability due to

automated screen printing process

TP(P12)Mini3I.Gen Target Applications

Additional Searches

TP(P 12)Mini3I.Gen, TP(P12)Mini 3 I.Gen, TP(P 12)Mini3 I.Gen, TP(P 12 )Mini 3I.Gen, TP(P12 )Mini 3 I.Gen, TPP12Mini3 IGen, TPP 12 Mini 3IGen, TPP12Mini3IGen, TPP 12Mini3 IGen, TPP12 Mini 3 IGen